AAT2514_08 ANALOGICTECH [Advanced Analogic Technologies], AAT2514_08 Datasheet - Page 13

• Manufacturer Part Number: AAT2514_08
• Description: Dual Channel 600mA Step-Down Converter
• Manufacturer: ANALOGICTECH [Advanced Analogic Technologies]

SwitchReg
Layout Guidance
Figure 1 is the schematic for a typical application. When
laying out the PC board, the following layout guidelines
should be followed to ensure proper operation of the
AAT2514:
1. Exposed pad must be reliably soldered to GND. The
2. The power traces, including the GND trace, the LX1/
3. The input capacitor (C1) should connect as closely as
2514.2008.02.1.1
exposed thermal pad should be connected to the
board ground plane and GND. The ground plane
should include a large exposed copper pad under the
package for thermal dissipation.
LX2 traces, and the VIN trace should be kept short,
direct and wide to allow large current flow. The L1/2
connection to the LX1/2 pins should be as short as
possible. Use several VIA pads when routing between
layers.
possible to IN and GND to get good power filtering.
TM
a: Top Layer
Figure 2: AAT2514 Typical Application Circuit Layout.
w w w . a n a l o g i c t e c h . c o m
Dual Channel 600mA Step-Down Converter
4. Keep the switching nodes, LX1/LX2, away from the
5. The feedback traces or FB pins should be separate
6. The output capacitors C2/C3 and L1/L2 should be
7. The resistance of the trace from the load return to
Figure 2 shows an example of a layout with 4 layers. The
2nd and 3rd layers are Internal GND Plane.
sensitive FB1/FB2 nodes.
from any power trace and connected as closely as
possible to the load point. Sensing along a high-
current load trace will degrade DC load regulation.
The feedback resistors should be placed as close as
possible to the FB pins to minimize the length of the
high impedance feedback trace.
connected as close as possible and there should not
be any signal lines under the inductor.
GND should be kept to a minimum. This will help to
minimize any error in DC regulation due to differ-
ences in the potential of the internal signal ground
and the power ground.
b: Bottom Layer
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