LGA-THSK-KIT-045 EMERSON-NETWORKPOWER [Emerson Network Power], LGA-THSK-KIT-045 Datasheet - Page 9

• Manufacturer Part Number: LGA-THSK-KIT-045
• Description: Embedded Power Device
• Manufacturer: EMERSON-NETWORKPOWER [Emerson Network Power]

Technical Reference Note
Applications (cont'd)
Recommend Placement Method
Use of a placement machine with front lighting and pad recognition is recommended. For best results,
place the LGA based on the centerpoint of the pad array (case silhouetting is not recommended for
placement).
Reflow Guidelines
For a SnPb process: pads should be above 183 °C (liquidus) for 90 seconds max (60-75 seconds typical)
with a peak temperature of 225 °C. For a leadfree SAC305 process: pads should be above 217 °C (liquidus)
for 90 seconds max (60-75 seconds typical) with a peak temperature of 250 °C.
The LGA Series products passed solderability testing per J-STD-002B and IEC-60068-2-58. The test was
conducted by Process Sciences, Inc in August, 2007
Thermal Hotspot
The electrical operating conditions of the LGA (shown below) determine how much power is dissipated
within the converter.
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The following parameters further influence the thermal stresses experienced by the converter:
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In order to simplify the thermal design, a number of thermal
derating plots are provided in this Technical Reference Note.
These derating graphs show the load current of the LGA
versus the ambient air temperature and forced air velocity.
However, since the thermal performance is heavily dependent
upon the final system application, the user needs to ensure
the thermal reference point temperatures are kept within
the recommended temperature rating. It is recommended
that the thermal reference point temperatures are measured
using a thermocouple or an IR camera. In order to comply
with stringent Emerson Network Power derating criteria the
ambient temperature should never exceed 85 °C. The case
maximum recommended temperature is 100 °C. Please
contact Emerson Network Power for further support.
Input voltage (Vin)
Output voltage (Vo)
Output current (Io)
Ambient temperature
Air velocity
Thermal efficiency of the end system application
Parts mounted on system PCB that may block airflow
Real airflow characteristics at the converter location
LGAXXX-0XSADJJ
Figure 11: Thermal Hotspots
2: Without Heatsink
1: With Heatsink
Embedded Power for
Business-Critical Continuity
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2
Rev. 12.07.09
LGA C Series
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