ESDA14V2-4BF STMICROELECTRONICS [STMicroelectronics], ESDA14V2-4BF Datasheet - Page 6

• Manufacturer Part Number: ESDA14V2-4BF
• Description: Quad bidirectional Transil array for ESD protection
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Ordering information
Note:
5
6/8
Figure 15. Flip Chip tape and reel specifications
More information is available in the application notes:
AN2348:"400 µm Flip Chip: Package description and recommendations for use"
AN1751: EMI Filters: Recommendations and measurements
Ordering information
Table 3.
Figure 13. Footprint
ESDA14V2-4BF3
Order code
Solder stencil opening:
Copper pad Diameter:
260 µm maximum
Solder mask opening:
300 µm minimum
220 µm recommended
220 µm recommended
All dimensions in mm
Ordering information
0.69 ± 0.05
Dot identifying Pin A1 location
Marking
EF
Package
Flip Chip
Figure 14. Marking
User direction of unreeling
4 ± 0.1
Dot
xx = marking
z = manufacturing location
yww = datecode
1.04
1.10 mg
Weight
(y = year
ww = week)
4 ± 0.1
Base qty
5000
Ø 1.5 ± 0.1
x
y
ESDA14V2-4BF3
Tape and reel 7”
Delivery mode
w
x
w
z