LH53259 SHARP [Sharp Electrionic Components], LH53259 Datasheet
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LH53259
Related parts for LH53259
LH53259 Summary of contents
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... DIP 28-pin, 450-mil SOP 2 28-pin, 8 13.4 mm TSOP (Type I) JEDEC standard EPROM pinout (DIP) DESCRIPTION The LH53259 is a mask-programmable ROM organ- ized as 32,768 8 bits fabricated using silicon-gate CMOS process technology. CMOS 256K (32K PIN CONNECTIONS 28-PIN DIP 28-PIN SOP V ...
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... (32,768 x 8) COLUMN SELECTOR SENSE AMPLIFIER TIMING GENERATOR OUTPUT BUFFER GND Figure 3. LH53259 Block Diagram NOTE SIGNAL Power supply (+ GND Ground NC No connection SUPPLY CURRENT NOTE 0 7 Standby 1 High-Z Operating D ...
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... 150 – 0 MHz 10 + MIN. TYP. MAX. 150 150 150 LH53259 TYP. MAX. UNIT NOTE 100 ...
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... LH53259 AC TEST CONDITIONS PARAMETER RATING Input voltage amplitude 0 2.4 V Input rise/fall time 10 ns Input reference level 1.5 V Output reference level 0.8 V and 2.2 V Output load condition 1TTL + 100 NOTE: Data becomes valid after the intervals t inputs, chip enable and output enable, respectively have been met. ...
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... MIN. 28-pin, 600-mil DIP 1.27 [0.050] TYP. 1.70 [0.067] 15 8.80 [0.346] 12.40 [0.488] 8.40 [0.331] 11.60 [0.457] 14 1.70 [0.067] 0.15 [0.006] 1.025 [0.040] 2.40 [0.094] 2.00 [0.079] 0.20 [0.008] 0.00 [0.000] 1.025 [0.040] 28-pin, 450-mil SOP LH53259 DETAIL 0.30 [0.012] 0.20 [0.008] 15.24 [0.600] TYP. 28DIP-2 10.60 [0.417] 0.20 [0.008] 0.10 [0.004] 28SOP 5 ...
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... TYP 8.20 [0.323] 7.80 [0.307] MAXIMUM LIMIT DIMENSIONS IN MM [INCHES] MINIMUM LIMIT ORDERING INFORMATION LH53259 X Device Type Package Example: LH53259D (CMOS 256K (32K x 8) Mask Programmable ROM, 28-pin, 600-mil DIP 12.00 [0.472] 13.70 [0.539] 11.60 [0.457] 13.10 [0.516] 14 0.15 [0.006] 1.10 [0.043] 0.90 [0.035] 1.20 [0.047] MAX. 0.425 [0.017] ...