K6R1008C1C-C10 SAMSUNG [Samsung semiconductor], K6R1008C1C-C10 Datasheet
K6R1008C1C-C10
Related parts for K6R1008C1C-C10
K6R1008C1C-C10 Summary of contents
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P Document Title 128Kx8 Bit High-Speed CMOS Static RAM(5V Operating). Operated at Commercial and Industrial Temperature Ranges. Revision History Rev. No. History Rev. 0.0 Initial release with Preliminary. Rev. 1.0 Release to Final Data Sheet. 1.1. Delete Preliminary. 2.2. Added Data Retention Characteristics. Rev. 2.0 Add 10ns part. ...
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... The device is fabricated using SAM- SUNG s advanced CMOS process and designed for high- speed circuit technology particularly well suited for use in high-density high-speed K6R1008C1C is packaged in a 400mil 32-pin plastic SOJ or TSOP2 forward. ORDERING INFORMATION K6R1008C1C-C10/C12/C15 K6R1008C1C-I10/I12/I15 PIN CONFIGURATION ...
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P ABSOLUTE MAXIMUM RATINGS* Parameter Voltage on Any Pin Relative Voltage on V Supply Relative Power Dissipation Storage Temperature Operating Temperature Commercial Industrial * Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied ...
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P AC CHARACTERISTICS ( TEST CONDITIONS* Parameter Input Pulse Levels Input Rise and Fall Times Input and Output timing Reference Levels Output Loads * bove test conditions are also applied at industrial temperature range. The a Output Loads(A) D OUT Capacitive Load consists of all components of the test environment ...
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P WRITE CYCLE* Parameter Symbol Write Cycle Time t WC Chip Select to End of Write t CW Address Set-up Time t AS Address Valid to End of Write t AW Write Pulse Width(OE High Write Pulse Width(OE Low) t WP1 Write Recovery Time t WR Write to Output High-Z ...
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P NOTES(READ CYCLE high for read cycle. 2. All read cycle timing is referenced from the last valid address to the first transition address and t are defined as the time at which the outputs achieve the open circuit condition and are not referenced to V ...
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P TIMING WAVEFORM OF WRITE CYCLE(3) Address CS WE High-Z Data in High-Z Data out NOTES(WRITE CYCLE) 1. All write cycle timing is referenced from the last valid address to the first transition address write occurs during the overlap of a low CS and WE. A write begins at the latest transition CS going low and WE going low ; ...
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P DATA RETENTION CHARACTERISTICS* Parameter Symbol V for Data Retention CC Data Retention Current Data Retention Set-Up Time Recovery Time * The above parameters are also guaranteed at industrial temperature range. Data Retention Characteristic is for L-ver only. DATA RETENTION WAVE FORM CS controlled ...
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... K6R1008C1C-C/C-L, K6R1008C1C-I/C-P PACKAGE DIMENSIONS 32-SOJ-400 #32 11.18 0.12 0.440 0.005 #1 +0.10 0.43 -0.05 0. +0.004 0.017 0.0375 -0.002 32-TSOP2-400CF #32 #1 21.35 0.841 20.95 0.825 0.95 0. 0.10 0.037 0.016 0.004 #17 #16 21.36 MAX 0.841 20.95 0.12 0.825 0.005 1.30 ( 0.051 1.30 ( 0.051 +0.10 0.71 -0.05 1.27 +0.004 0.028 0.050 -0.002 #17 11.76 0.20 0.463 0.008 #16 MAX 0.10 0.004 1.00 0.10 0.039 0.047 0.004 1.27 0.05 MIN 0.050 0.002 - 9 - PRELIMINARY PRELIMINARY ...