K6R1016C1C SAMSUNG [Samsung semiconductor], K6R1016C1C Datasheet

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K6R1016C1C

Manufacturer Part Number
K6R1016C1C
Description
64Kx16 Bit High-Speed CMOS Static RAM(5.0V Operating).
Manufacturer
SAMSUNG [Samsung semiconductor]
Datasheet

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K6R1016C1C-C/C-L, K6R1016C1C-I/C-P
Document Title
Revision History
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any questions,
please contact the SAMSUNG branch office near your office, call or contact Headquarters.
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
64Kx16 Bit High-Speed CMOS Static RAM(5.0V Operating).
Operated at Commercial and Industrial Temperature Ranges.
Rev. No.
Rev. 0.0
Rev. 1.0
Rev. 2.0
Rev. 2.1
Rev. 2.2
Rev. 3.0
Rev. 3.1
Rev. 4.0
History
Initial release with preliminary.
Relax DC characteristics.
Add 48-fine pitch BGA.
Changed device part name for FP-BGA.
ex) K6R1016C1C-Z -> K6R1016C1C-F
Changed device ball name for FP-BGA.
Added Data Retention Characteristics.
Add 10ns part.
Delete 20ns speed bin
I
CC
I/O9 ~ I/O16
Symbol
I/O1 ~ I/O8
Previous
Item
Item
12ns
15ns
20ns
Previous
Previous
90mA
88mA
85mA
Z
- 1 -
I/O9 ~ I/O16
I/O1 ~ I/O8
Changed
Changed
Changed
95mA
93mA
90mA
F
Aug. 5. 1998
Sep. 7. 1998
Sep. 17. 1998
Nov. 5. 1998
Dec. 10. 1998
Mar. 3. 1999
Mar. 3. 2000
Sep.24. 2001
Draft Data
CMOS SRAM
September 2001
Preliminary
Preliminary
Preliminary
Final
Final
Final
Final
Final
Remark
Revision 4.0

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K6R1016C1C Summary of contents

Page 1

... I 12ns CC 15ns 20ns Rev. 2.0 Add 48-fine pitch BGA. Rev. 2.1 Changed device part name for FP-BGA. Item Symbol ex) K6R1016C1C-Z -> K6R1016C1C-F Rev. 2.2 Changed device ball name for FP-BGA. Previous I/O1 ~ I/O8 I/O9 ~ I/O16 Rev. 3.0 Added Data Retention Characteristics. Rev. 3.1 Add 10ns part. Rev. 4.0 Delete 20ns speed bin The attached data sheets are prepared and approved by SAMSUNG Electronics ...

Page 2

... The K6R1016C1C is a 1,048,576-bit high-speed Static Random Access Memory organized as 65,536 words by 16 bits. The K6R1016C1C uses 16 common input and output lines and has at output enable pin which operates faster than address access time at read cycle. Also it allows that lower and upper byte access by data byte control (UB, LB) ...

Page 3

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P PIN CONFIGURATION(TOP VIEW SOJ/ I Vcc 11 34 TSOP2 Vss ...

Page 4

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P DC AND OPERATING CHARACTERISTICS* Parameter Symbol Input Leakage Current I LI Output Leakage Current I LO Operating Current I CC Standby Current SB1 Output Low Voltage Level Output High Voltage Level V ** OH1 * The above parameters are also guaranteed at industrial temperature range. ...

Page 5

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P READ CYCLE* Parameter Symbol Read Cycle Time t RC Address Access Time t AA Chip Select to Output t CO Output Enable to Valid Output t OE UB, LB Access Time t BA Chip Enable to Low-Z Output t LZ UB, LB Enable to Low-Z Output t BLZ Output Enable to Low-Z Output ...

Page 6

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P TIMING WAVEFORM OF READ CYCLE(2) Address CS UB Data out High Current SB NOTES(READ CYCLE high for read cycle. 2. All read cycle timing is referenced from the last valid address to the first transition address and t are defined as the time at which the outputs achieve the open circuit condition and are not referenced to V ...

Page 7

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P TIMING WAVEFORM OF WRITE CYCLE(2) Address CS UB Data in Data out TIMING WAVEFORM OF WRITE CYCLE(3) Address CS UB High-Z Data in High-Z Data out (OE =Low fixed CW( WP1(2) AS( High-Z Valid Data t WHZ(6) High-Z (CS=Controlled CW( ...

Page 8

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P TIMING WAVEFORM OF WRITE CYCLE(4) Address CS UB High-Z Data in High-Z Data out NOTES(WRITE CYCLE) 1. All write cycle timing is referenced from the last valid address to the first transition address write occurs during the overlap of a low CS, WE, LB and UB. A write begins at the latest transition CS going low and WE going low ...

Page 9

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P DATA RETENTION CHARACTERISTICS* Parameter Symbol V for Data Retention CC Data Retention Current Data Retention Set-Up Time Recovery Time * The above parameters are also guaranteed at industrial temperature range. Data Retention Characteristic is for L-ver only. DATA RETENTION WAVE FORM CS controlled ...

Page 10

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P PACKAGE DIMENSIONS 44-SOJ-400 #44 11.18 0.12 0.440 0.005 #1 +0.10 0.43 -0.05 +0.004 0.95 0.017 ( ) -0.002 0.0375 44-TSOP2-400BF #44 #1 18.81 MAX 0.741 18.41 0.10 0.725 0.004 0.10 0.30 0.05 0.805 ( ) 0.004 0.012 0.032 0.002 #23 #22 28.98 MAX 1.141 25.58 0.12 1.125 0.005 +0.10 0.71 -0.05 1.27 +0.004 0.028 0.050 -0.002 0.25 0.010 TYP #23 11.76 0.20 0.463 0.008 #22 1.00 1.20 0.10 MAX 0.039 0.047 0.004 0.10 MAX 0.05 0.004 MIN 0 ...

Page 11

... K6R1016C1C-C/C-L, K6R1016C1C-I/C-P PACKAGE OUTLINE Top View B #A1 Side View D C Min Typ A - 0.75 B 5.90 6. 3.75 C 6.90 7. 5.25 D 0. 0.80 E2 0.20 0. Bottom View Detail A Max - Notes. 6.10 1. Bump counts: 48(8row x 6column) 2. Bump pitch : (x,y)=(0.75 x 0.75)(typ All tolerence are +/-0.050 unless 7 ...

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