HSMS-C260 HP [Agilent(Hewlett-Packard)], HSMS-C260 Datasheet - Page 2

• Manufacturer Part Number: HSMS-C260
• Description: Surface Mount Chip LEDs
• Manufacturer: HP [Agilent(Hewlett-Packard)]

Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
Absolute Maximum Ratings at T
Notes:
1. Derate linearly as shown in Figure 4 for temperature above 25 C.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
Package Dimensions
DC Forward Current
Peak Pulsing Current
Power Dissipation
Reverse Voltage (I
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
(0.020 ± 0.006)
Parameter
0.50 ± 0.15
PC BOARD
DIFFUSED
0.1 mm ( 0.004 in.) unless otherwise specified.
1.1 (0.043)
EPOXY
R
= 100 A)
[1]
[2]
LED DIE
HSMx-C260
SOLDERING
3.4 (0.134)
TERMINAL
1.2 (0.047)
A
0.3 (0.012)
=25 C
1.25 (0.049)
(0.020 ± 0.006)
1.1 (0.043)
0.50 ± 0.15
HSMx-C260
CATHODE
MARK
-25 to +80
-30 to +85
100
25
65
95
POLARITY
5
See IR soldering profile (Figure 6)
2
Units
mW
mA
mA
V
C
C
C