HMC591_09 HITTITE [Hittite Microwave Corporation], HMC591_09 Datasheet - Page 5

• Manufacturer Part Number: HMC591_09
• Description: GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 6 - 10 GHz
• Manufacturer: HITTITE [Hittite Microwave Corporation]

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3
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
GP-1 (Gel Pack)
Standard
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
Alternate
v02.0109
[2]
Order On-line at www.hittite.com
[1]
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ± .002
POWER AMPLIFIER, 6 - 10 GHz
GaAs PHEMT MMIC 2 WATT
HMC591