HSMB-CXXX AVAGO [AVAGO TECHNOLOGIES LIMITED], HSMB-CXXX Datasheet
HSMB-CXXX
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HSMB-CXXX Summary of contents
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... HSMB-Cxxx Surface Mount Chip LEDs Data Sheet HSMB-C190, HSMB-C170, HSMB-C110, HSMB-C150, HSMB-C191 Description These Blue chip LEDs are designed in an industry standard package for ease of handling and use. Blue color chip LED is a new product that offers color differentiation for backlighting applications. The HSMB-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMB- C170 has the widely used 2.0 x 1.25 mm footprint. The HSMB-C190 and HSMB-C191 have the industry standard 1.6 x 0.8 mm footprint, and their low profiles (0.8 mm for HSMB-C190 and 0.6 mm for HSMB-C191) and wide view- ing angles make these LEDs exceptional for backlighting applications ...
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... EPOXY 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) SOLDERING TERMINAL HSMB-C170 HSMB-C190 Pkg Dimen - b (C170) CATHODE MARK LED DIE 0.8 (0.031) 3.2 (0.126 ) 2.0 (0.079) 0.5 (0.020) CATHODE LINE 0.50 ± 0.2 (0.020 ± 0.008) SOLDERING TERMINAL HSMB-C150 HSMx-C190 Pkg Dimen - a (C150) POLARITY 1 ...
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... Power Dissipation Reverse Voltage (I = 100 µA) R Maximum LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature N otes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. 3 CATHODE MARK 0.8 (0.031) POLARITY 0.6 (0.023) 0.3 ± 0.15 0.7 (0.028) MIN. HSMB-C190/C170/C110/C150/C191 20 100 -30 to +85 -40 to +85 See reflow soldering profile (Figure 7 & 8) Units °C °C °C ...
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... SiC Blue C190/C170/ C150/C191 HSMB-C110 SiC Blue N otes: 1. The luminous intensity measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the v lamp package the off-axis angle where the luminous intensity is 1/2 the peak intensity. 1/2 Electrical Characteristics at T =25°C A Part No. HSMB-C190/C170/C150/C191 HSMB-C110 V Tolerance: ±0 [1] Blue Color Bins Dom. Wavelength (nm) Bin ID Min. Max. A 460.0 465.0 B 465.0 470.0 C 470.0 475.0 ...
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... HSMB-C190 fig -90 -80 -70 -60 -50 -40 -30 -20 -10 0 ANGLE Figure 5. Relative Intensity vs. Angle for HSMB-C110. HSMB-C190 fig 5b 1.2 1.0 0.8 0.6 0.4 0 – FORWARD CURRENT – Figure 3. Relative Luminous Intensity vs. Forward Current. HSMB-C190 fig ...
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... ANGLE Figure 6. Relative Intensity vs. Angle for HSMB-C170, HSMB-C190, HSMB-C150, and HSMB-C191. HSMB-C190 fig 6 255 - 260 °C 3 °C/SEC. MAX. 217 °C 200 °C 150 °C 3 °C/SEC. MAX 120 SEC. TIME Figure 8. Recommended Pb-free Reflow Soldering Profile. ...
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... Figure 12. Recommended Soldering Pattern for HSMB-C150. HSMX-C190 fig 8 3.0 ± 0.5 (0.118 ± 0.020) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 14. Reel Dimensions. Note: 1. All dimensions in millimeters (inches). 7 PRINTED LABEL Figure 13. Reeling Orientation. Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø ...
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... THERE SHALL BE A MOUNTED WITH MINIMUM OF 160 mm COMPONENTS (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 16. Tape Leader and Trailer Dimensions. Notes: HSMB-C190 fig 14 1. All dimensions in millimeters (inches). 2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specified. 8 CATHODE 1.50 (0.059) 1.75 (0.069) (0.138 ± 0.002) USER FEED ...
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Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of ...