LA182B-1-230-I-PF LIGITEK [LIGITEK electronics co., ltd.], LA182B-1-230-I-PF Datasheet
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LA182B-1-230-I-PF
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LA182B-1-230-I-PF Summary of contents
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... LED ARRAY DOC REV. DATE LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LA182B-1/230-I-PF DATA SHEET QW0905-L A182B-1/230-I- Feb 2006 Pb Lead-Free Parts ...
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... PART NO. LA182B-1/230-I-PF Package Dimensions Ø 3.2*16 EG 5.0 EG 5.0 EG 5.0 EG 2.5 2.54TYP LEG2362/S10-PF Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.4 ± 0.5 19.7 5.0*3 3 ...
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... Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 MATERIAL PART NO GaAsP/GaP LA182B-1/230-I-PF GaP Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only ℃ ...
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... PART NO. LA182B-1/230-I-PF Typical Electro-Optical Characteristics Curve E CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 550 600 650 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...
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... PART NO. LA182B-1/230-I-PF Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...
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... PART NO. LA182B-1/230-I-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° ...
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... PART NO. LA182B-1/230-I-PF Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95 % High Humidity Test 3.t=240hrs 1 ...