MAS9078BTB1 MAS [Micro Analog systems], MAS9078BTB1 Datasheet - Page 2

• Manufacturer Part Number: MAS9078BTB1
• Description: AM Receiver IC
• Manufacturer: MAS [Micro Analog systems]

PAD LAYOUT
Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Please make sure that VDD is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Coordinates are pad center points where origin has been located in the center of VDD pad
Note: The on-chip product code 9078Bx identifies internal compensation capacitance option. x has values 1, 2,
3, 4 or 5 refering to capacitance option described in the Table 2 on page 4.
Pin Description
Power Supply Voltage
Quarz Filter Output
Quarz Filter Input
AGC Capacitor
Receiver Output
Demodulator Capacitor
AGC On Control
Power Down Input
Receiver Input
Power Supply Ground
Notes:
1) OUT = VSS when carrier amplitude at maximum; OUT = VDD when carrier amplitude is reduced
2) AON = VSS means AGC off (hold current gain level); AON = VDD means AGC on (working)
3) PDN = VSS means receiver on; PDN = VDD means receiver off
(modulated)
-
-
-
-
the output is a current source/sink with |I
at power down the output is pulled to VSS (pull down switch)
Internal pull-up with current < 1 µA which is switched off at power down
Fast start-up is triggered when the receiver is after power down (PDN=VDD) controlled to power up
(PDN=VSS) i.e. at the falling edge of PDN signal.
DIE size = 1.70 x 1.78 mm; PAD size = 100 x 100 µm
9078Bx
MAS
Name
AON
VDD
AGC
OUT
DEC
PDN
VSS
RFI
QO
QI
VSS RFI PDN AON DEC
VDD QO
1702 µm
OUT
X-coordinate
QI AGC OUT
1109 µm
1109 µm
| > 5 µA
306 µm
586 µm
866 µm
866 µm
549 µm
306 µm
16 µm
0 µm
Y-coordinate
1428 µm
1428 µm
1428 µm
1428 µm
1407 µm
19 µm
19 µm
19 µm
19 µm
0 µm
1778 µm
28 January 2004
Note
DA9078.003
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