U3666M-MDP TEMIC [TEMIC Semiconductors], U3666M-MDP Datasheet
U3666M-MDP
Related parts for U3666M-MDP
U3666M-MDP Summary of contents
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... Application In TV sets, the integrated baseband delay line circuit is suitable for decoders with color-difference signal outputs Description The integrated delay line circuit U3666M is suitable for all chroma decoders with baseband outputs suitable for PAL-, SECAM- and NTSC-signals as well. The U3666M contains two separate delay lines for processing (R– ...
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... U3666M Ordering Information Extended Type Number U3666M-MDP U3666M-MFP Pin Description 1 V DD2 2 NC GND2 10649 Figure 2. Connection diagram Absolute Maximum Ratings Reference point Pin 3, 10, unless otherwise specified Parameters Supply voltage (Pin 9) Supply voltage (Pin 1) ...
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... V (n+1) W < 300 V gen noise Pin 11 63. load Pin 11 load Pin 11, 12 Pin slice U3666M Typ. Max. Unit 5.0 5.5 V 5.0 5.5 V 3.5 8 0.525 1.0 V 0.665 1.0 V 1.05 2.0 V 1.33 2 1. ...
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... U3666M SC-impulse Internal clamping 95 10355 BGP (9) Preliminary Information BGP H-pulse m 0 1.6 s Figure 3. Timing of internal clamping Figure 4. Restrictions to SC pulse No higher than least 1 10226 TELEFUNKEN Semiconductors Rev. A1, 10-Feb-97 ...
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... 2,4,6,7,8,13,15 16 Baseband delay line Figure 5. Typical application circuit Baseband delay line SC-impulse 10227 Figure 7. Application with 5 V SC-pulse U3666M NC 94 8848 " (R–Y) 11 " (B– Baseband delay line 10354 5 (9) ...
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... U3666M Internal Pin Circuits 14,16 Figure 8. Color-difference signal inputs 95 10359 Figure 9. Color-difference signal outputs 6 (9) Preliminary Information 5 95 10356 Figure 10. Sandcastle-pulse input 1,9 11,12 Figure 11. Supply voltage V 95 10357 95 10358 , V DD2 DD1 TELEFUNKEN Semiconductors Rev. A1, 10-Feb-97 ...
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... Package SO16 Dimensions in mm TELEFUNKEN Semiconductors Rev. A1, 10-Feb-97 Preliminary Information 20.0 max 19.8 max 4.8 max 0.5 min 0.58 2.54 0.48 17. U3666M 7.82 7.42 6.4 max 3.3 0.39 max 9.75 8.15 technical drawings technical drawings technical drawings according to DIN according to DIN according to DIN specifications specifications specifications 96 11709 94 8875 7 (9) ...
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... U3666M Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment ...