EMIF02-AV01F3_10 STMICROELECTRONICS [STMicroelectronics], EMIF02-AV01F3_10 Datasheet - Page 5

• Manufacturer Part Number: EMIF02-AV01F3_10
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

EMIF02-AV01F3
Note:
4
Figure 14. Flip Chip tape and reel specification
Note: More information is available in the application note:
AN2348:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
Ordering information
Table 3.
Figure 12. Footprint
EIMF02-AV01F3
Order code
Solder stencil opening:
Copper pad Diameter:
260 µm maximum
Solder mask opening:
300 µm minimum
220 µm recommended
220 µm recommended
Ordering information
Dot identifying Pin A1 location
0.69 ± 0.05
Marking
HH
Doc ID 12835 Rev 4
Package
Flip Chip
0.87
Figure 13. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
Weight
1.4 mg
4.0 ± 0.1
(y = year
ww = week)
4.0 ± 0.1
Base qty
5000
Ø 1.5 ± 0.1
Ordering information
x
y
Tape and reel 7”
w
Delivery mode
x
E
w
z
5/7