EMIF03-SIM01F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF03-SIM01F2_08 Datasheet - Page 5

• Manufacturer Part Number: EMIF03-SIM01F2_08
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

EMIF03-SIM01F2
4
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Package dimensions
Figure 14. Flip Chip tape and reel specification
Figure 12. Footprint
340 µm min for 315 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Copper pad Diameter:
All dimensions in mm
210 µm
0.73 ± 0.05
Dot identifying Pin A1 location
1.42 mm ± 50 µm
500 µm ± 50
315 µm ± 50
Figure 13. Marking
User direction of unreeling
4 ± 0.1
1.52
Dot, ST logo
xx = marking
z = manufacturing
location
yww = datecode
(y = year
4 ± 0.1
ww = week)
Ø 1.5 ± 0.1
650 µm ± 65
Package information
x
y
w
x
E
w
z
®
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