EMIF10-COM01F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF10-COM01F2_08 Datasheet
EMIF10-COM01F2_08
Related parts for EMIF10-COM01F2_08
EMIF10-COM01F2_08 Summary of contents
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... Communication systems ■ Mobile phones Description The EMIF10-COM01F2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges ...
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... Test conditions = 2.5 µ 100 kΩ load Figure 4. 0.00 0. -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 -50.00 -50.00 -60.00 -60.00 -70.00 -70.00 -80.00 -80.00 -90.00 -90.00 -100.00 -100.00 100.0M 100.0M 100.0M 1.0G 1.0G 1.0G EMIF10-COM01F2 Value 15 8 125 - 150 slope : Min. Typ. Max 500 1 180 200 220 Analog crosstalk 100.0k 100 ...
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... Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output (V in Figure 7. Rise time measurement Square signal Generator Vc = 2.8V Figure 8. Capacitance versus reverse applied voltage Figure 6. ) out V(in1) V(out1) EMIF10-COM01F2 In Out Vout Vin 100k C(pF VR(V) Characteristics ...
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... Application information Figure 9. Aplac model in MODEL = demif10 2.1 PCB grounding recommendations In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we recommend to implement microvias (100 µm dia.) between the GND bumps and the GND layer. GND bumps can be connected together in PCB layer 1, and in addition, if possible, use through hole vias (200 µ ...
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... EMIF10-COM01F2 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Die shrink. Replaced Figures 3 and 13. Added ECOPACK 3 statement. Reformatted to current standard. Pin identification in 4 Figure 1 updated. Updated ECOPACK statement. Updated 5 Figure 11 and standards. EMIF10-COM01F2 Ø 1.5 ± 0.1 2.6 4 ± 0.1 Base qty Delivery mode 5000 Tape and reel Description of changes Figure Figure 14. Reformatted to current ...
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... EMIF10-COM01F2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...