AZ10/100ELT20L AZM [Arizona Microtek, Inc], AZ10/100ELT20L Datasheet - Page 5

• Manufacturer Part Number: AZ10/100ELT20L
• Description: CMOS/TTL to Differential PECL Translator
• Manufacturer: AZM [Arizona Microtek, Inc]

AZ10ELT20
AZ100ELT20
AZ10/100ELT20 DIE:
PAD CENTER COORDINATES
NC = No connect, leave open.
April 2007 * REV - 18
NAME
M
A
B
C
D
G
H
K
E
F
L
I
J
Note: Other die thicknesses available. Contact factory for further information.
The die backside may be left open or connected to GND.
ELT20 22
PAD DESIGNATION
C
D
A
B
DIE THICKNESS: 14 mils
GND
DIE SIZE: 950u X 940u
10K
BOND PAD: 85u X 85u
V
V
NC
NC
NC
NC
NC
www.azmicrotek.com
NC
D
Q
Q ¯
CC
CC
DIE PAD COORDINATES
M
5
E
X(Microns)
F
-342.5
-342.5
-342.5
-342.5
-140.5
126.5
312.5
312.5
312.5
312.5
302.5
142.5
-33.5
L
K
H
G
J
I
Y(Microns)
-255.0
-312.5
-312.5
-248.5
312.5
144.5
201.5
342.5
342.5
342.5
-87.0
-98.5
51.5