EM6580SO14A EMMICRO [EM Microelectronic - MARIN SA], EM6580SO14A Datasheet - Page 56

• Manufacturer Part Number: EM6580SO14A
• Description: Ultra Low Power 8-pin Flash Microcontroller
• Manufacturer: EMMICRO [EM Microelectronic - MARIN SA]

21. Ordering Information
In its packaged form, EM6580 comes in green mold /lead free (symbolized by a “+” at the end of the part number).
Ordering Part Number (selected examples)
Please make sure to give the complete Part Number when ordering.
21.1 Package Marking
First line:
Second line:
Third line:
First line:
Second line:
Third line:
Where: PP…P = Production identification (date & lot number) of EM Microelectronic-Marin SA
Copyright © 2006, EM Microelectronic-Marin SA
Part Number
EM6580SO8A +
EM6580SO8B +
EM6580SO14A +
EM6580SO14B +
EM6580WS11
EM6580WP11
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in
the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site.
EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or
specifications detailed herein at any time without notice, and does not make any commitment to update the information
contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM
products, expressly or by implications. EM's products are not authorized for use as components in life support devices or
systems.
Packaged Device:
Package:
SO8 = 8 pin SOIC
SO14 = 14 pin SOIC
Delivery Form:
A = Stick
B = Tape&Reel
Y = year of assembly
R
8-pin SOIC marking:
14-pin SOIC marking:
R 1 A
R 1 A
E M 6 5 8 0 0
P P P P P P P P
6 5 8 0 0 1
P P P P P P
EM6580 SO8 A+
Package/Die Form
8 pin SOIC
8 pin SOIC
14 pin SOIC
14 pin SOIC
Sawn wafer
Die in waffle pack
Y
Y P
1
Delivery Form/ Thickness
Tape&Reel
Tape&Reel
11 mils
11 mils
Stick
Stick
Device in DIE Form:
EM6580
WS 11
56
© EM Microelectronic-Marin SA, 01/06, Rev. F
Die form:
WW = Wafer
WS = Sawn Wafer/Frame
WP = Waffle Pack
Thickness:
11 = 11 mils (280um), by default
27 = 27 mils (686um), not backlapped
(for other thickness, contact EM)
www.emmicroelectronic.com
EM6580