K9K4G16Q0M SAMSUNG [Samsung semiconductor], K9K4G16Q0M Datasheet - Page 35

• Manufacturer Part Number: K9K4G16Q0M
• Description: 512M x 8 Bit / 256M x 16 Bit NAND Flash Memory
• Manufacturer: SAMSUNG [Samsung semiconductor]

K9W8G08U1M
K9K4G08Q0M
K9K4G08U0M
RESET
The device offers a reset feature, executed by writing FFh to the command register. When the device is in Busy state during random
read, program or erase mode, the reset operation will abort these operations. The contents of memory cells being altered are no
longer valid, as the data will be partially programmed or erased. The command register is cleared to wait for the next command, and
the Status Register is cleared to value C0h when WP is high. Refer to table 3 for device status after reset operation. If the device is
already in reset state a new reset command will be accepted by the command register. The R/B pin transitions to low for tRST after
the Reset command is written. Refer to Figure 15 below.
Figure 15. RESET Operation
Table3. Device Status
Read ID
The device contains a product identification mode, initiated by writing 90h to the command register, followed by an address input of
00h. Five read cycles sequentially output the manufacturer code(ECh), and the device code and XXh, 4th cycle ID respectively. The
command register remains in Read ID mode until further commands are issued to it. Figure 14 shows the operation sequence.
Figure 14. Read ID Operation
R/B
I/O
CLE
CE
WE
ALE
RE
I/O
X
Operation Mode
X
PRE status
90h
FFh
K9K4G16Q0M
K9K4G16U0M
First page data access is ready
Address. 1cycle
00h
High
t
CLR
K9W8G08U1M
K9K4G08Q0M
K9K4G16Q0M
K9K4G08U0M
K9K4G16U0M
t
WHR
Device
After Power-up
t
AR1
t
CEA
t
REA
t
RST
Maker code
35
00h command is latched
ECh
Device Code*(2nd Cycle)
Low
Device code
Same as each K9K4G08U0M in it
ACh
DCh
BCh
CCh
Device
Code*
XXh
FLASH MEMORY
Waiting for next command
4th Cycle*
4th Cyc.*
After Reset
15h
15h
55h
55h