MPXV5050V FREESCALE [Freescale Semiconductor, Inc], MPXV5050V Datasheet - Page 4

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MPXV5050V

Manufacturer Part Number
MPXV5050V
Description
High Temperature Accuracy Integrated Silicon Pressure Sensor
Manufacturer
FREESCALE [Freescale Semiconductor, Inc]
Datasheet
MPXV5050VC6T1
4
On-chip Temperature Compensation and Calibration
Super Small Outline chip carrier (Case 482A).
current operation).
pressure input. Typical minimum and maximum output
curves are shown for operation over 0° to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Lead
Frame
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 2
Figure 3
Figure 4
Pressure
Wire
Bond
Differential Sensing
illustrates the absolute sensing chip in the basic
shows a typical application circuit (output source
shows the sensor output signal relative to
Element
Fluorosilicone
Gel Die Coat
5
4
3
2
1
0
–50
Transfer Function:
V
V
PE = 1.25
TM = 1
Temperature = 0 to 85°C
out
s
= 5.0 ± 0.25 vdc
= V
S
x (0.018 x P + 0.92) ± (PE x TM x 0.018 x V
P1
P2
–40
MAX
Die
Figure 4. Output vs. Absolute Pressure
Transfer Function MPXV5050VC Series
Die Bond
–30
Pressure (kPa)
Steel Cap
Stainless
Thermoplastic
Case
s
)
MIN
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXV5050
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
–20
A fluorosilicone gel isolates the die surface and wire bonds
1.0 μF
Figure 3. Typical Application Circuit
(Output Source Current Operation)
TYPICAL
–10
0.01 μF
V
s
+5 V
GND
IPS
Freescale Semiconductor
V
out
0
470 pF
Offset
(Typ)
OUTPUT
Sensors

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