US5881LSE-AAA-000-RE Melexis, US5881LSE-AAA-000-RE Datasheet - Page 8
![no-image](/images/no-image-200.jpg)
US5881LSE-AAA-000-RE
Manufacturer Part Number
US5881LSE-AAA-000-RE
Description
US5881 Series 3.5 to 24 V SMT Unipolar Hall Switch - Low Sensitivity - SOT-23-3
Manufacturer
Melexis
Datasheet
1.US5881LSE-AAA-000-RE.pdf
(11 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
US5881LSE-AAA-000-RE
Manufacturer:
MELEXIS/迈来芯
Quantity:
20 000
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
•
•
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
•
Iron Soldering THD’s (Through Hole Devices)
•
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
•
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification
tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding
assurance of adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For
more information on qualifications of RoHS compliant products (RoHS = European directive on the
Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
14 Standard information regarding manufacturability of Melexis
products with different soldering processes
15 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901005881
Rev 008
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
Page 8 of 11
Unipolar Hall Switch – Low Sensitivity
US5881
Data Sheet
Mar/12