M24C16-WMN6TP/S STMicroelectronics, M24C16-WMN6TP/S Datasheet - Page 5

• Manufacturer Part Number: M24C16-WMN6TP/S
• Manufacturer: STMicroelectronics

M24C16, M24C08, M24C04, M24C02, M24C01
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
M24C08-F WLCSP and thin WLCSP connections
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum R
I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 29
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 31
TSSOP8 3 x 3 mm – 8 lead thin shrink small outline, 3 x 3 mm body size,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 33
(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
P
value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . 10
Doc ID 5067 Rev 13
List of figures
5/40