592D106X9016C2T Vishay Sprague, 592D106X9016C2T Datasheet - Page 11

• Manufacturer Part Number: 592D106X9016C2T
• Description: Single Components, Passive Components, Capacitors
• Manufacturer: Vishay Sprague

www.vishay.com
11
592D
Vishay Sprague
GUIDE TO APPLICATION (Continued)
3.1
3.2
4.
5.
6.
CASE CODE/SUFFIX
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating or 1 volt maximum at
+ 25 °C and 5 % of the DC voltage rating or 0.5 volt
maximum at + 85 °C.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be
established when calculating permissible operating
levels. (Power dissipation calculated using + 25 °C
temperature rise.)
TEMPERATURE
A/15H
B/15H
C/15H
D/15H
R/15H
B/20H
C/20H
D/20H
R/20H
X/20H
X/25H
+ 125 °C
+ 25 °C
+ 85 °C
AT + 25 °C (WATTS) IN FREE AIR
MAXIMUM PERMISSIBLE
POWER DISSIPATION
DERATING FACTOR
For technical questions, contact: [e-mail]
0.125
0.175
0.175
0.180
0.06
0.08
0.10
0.15
0.08
0.11
0.14
Conformal Coated, Maximum CV
1.0
0.9
0.4
Solid Tantalum Chip Capacitors
TANTAMOUNT®, Low Profile,
7.
8.
8.1
8.2
Printed Circuit Board Materials: The capacitors are
compatible with most commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel). If your
desired board material is not shown there please con-
tact the Tantalum Marketing Department for assist-
ance in determining compatibility.
Attachment:
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
Soldering: Capacitors can be attached by conven-
tional soldering techniques, vapor phase, convection,
infrared reflow wave soldering and hot plate methods.
The Soldering Profile charts show typical recom-
mended time/temperature conditions for soldering.
Preheating is recommended. The recommended
maximum ramp rate is 2 °C per second. Attachment
with a soldering iron is not recommended due to the
difficulty of controlling temperature and time at
temperature. The soldering iron must never come in
contact with the capacitor.
Document Number: 40004
Revision: 01-Dec-05