8536CGI-33LF IDT, 8536CGI-33LF Datasheet - Page 14

• Manufacturer Part Number: 8536CGI-33LF
• Description: Clock Drivers & Distribution
• Manufacturer: IDT

Specifications of 8536CGI-33LF

• Rohs: yes
• Part # Aliases: ICS8536CGI-33LF

2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
flow and a multi-layer board, the appropriate value is 91.1°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
IDT
ABLE
ICS8536I-33
LOW SKEW, 1-TO-6, CRYSTAL OSCILLATOR/LVCMOS-TO-3.3V, 2.5V LVPECL/LVCMOS FANOUT BUFFER
™
/ ICS
7. T
Multi-Layer PCB, JEDEC Standard Test Boards
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.3993W * 91.1°C/W = 121.4°C. This is below the limit of 125°C.
™
JA
A
3.3V, 2.5V LVPECL/ LVCMOS FANOUT BUFFER
= Ambient Temperature
HERMAL
= Junction-to-Ambient Thermal Resistance
R
ESISTANCE
JA
FOR
20-
JA
PIN
by Velocity (Linear Feet per Minute)
TSSOP, F
JA
* Pd_total + T
ORCED
A
C
14
91.1°C/W
ONVECTION
0
TM
devices is 125°C.
86.7°C/W
200
ICS8536CGI-33 REV. B OCTOBER 27, 2008
JA
must be used. Assuming no air
84.6°C/W
500