S9S12G96F0CLL Freescale Semiconductor, S9S12G96F0CLL Datasheet - Page 1289

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S9S12G96F0CLL

Manufacturer Part Number
S9S12G96F0CLL
Description
16-bit Microcontrollers - MCU 16BIT 96K FLASH
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of S9S12G96F0CLL

Rohs
yes
Core
S12
Processor Series
MC9S12G
Data Bus Width
16 bit
Maximum Clock Frequency
25 MHz
Program Memory Size
96 KB
Data Ram Size
8 KB
On-chip Adc
Yes
Operating Supply Voltage
5 V
Operating Temperature Range
- 40 C to + 85 C
Package / Case
LQFP-100
Mounting Style
SMD/SMT

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Quantity
Price
Part Number:
S9S12G96F0CLL
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Quantity:
1 800
Part Number:
S9S12G96F0CLL
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Quantity:
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Part Number:
S9S12G96F0CLL
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Freescale Semiconductor
Die Pad
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
Bond Post
MC9S12G Family Reference Manual, Rev.1.23
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
77
78
79
80
81
82
83
84
85
86
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
1707.5
1598.5
1477.5
1237.5
1117.5
947.5
777.5
652.5
527.5
422.5
327.5
242.5
Y Coordinate
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
Die Pad
1026.5
1133.5
1240.5
1347.5
-467.5
-360.5
-253.5
-148.5
172.5
279.5
386.5
493.5
598.5
705.5
812.5
919.5
-41.5
65.5
Function
PAD[10]
PAD[11]
PAD[12]
PAD[13]
PAD[14]
PAD[15]
PAD[9]
PAD[2]
PAD[3]
PAD[4]
PAD[5]
PAD[6]
PAD[7]
VDDA
VSSA
PC[4]
PC[5]
PC[6]
PC[7]
PD[0]
PD[1]
PD[2]
PD[3]
PS[0]
PS[1]
PS[2]
PS[3]
PS[4]
VRH
VRL
Package and Die Information
1291

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