MC10EL16DTG ON Semiconductor, MC10EL16DTG Datasheet - Page 2

• Manufacturer Part Number: MC10EL16DTG
• Description: IC RECEIVER ECL DIFF 5V 8TSSOP
• Manufacturer: ON Semiconductor
• Series: 10ELr

Specifications of MC10EL16DTG

• Logic Type: Differential Receiver
• Supply Voltage: 4.2 V ~ 5.7 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Logic Family: 100EL
• Supply Voltage (max): - 5.7 V, 5.7 V
• Supply Voltage (min): - 4.2 V, 4.2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Interface: EIA/JESD78
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): / /
• Supply Current: 22 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Bits: -
• Lead Free Status / Rohs Status: Details
• Other names: MC10EL16DTGOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 3. MAXIMUM RATINGS
V
V
V
I
I
T
T
q
q
q
q
q
T
q
Symbol
out
BB
A
stg
JA
JC
JA
JC
JA
sol
JC
CC
EE
I
PECL Mode Power Supply
NECL Mode Power Supply
PECL Mode Input Voltage
NECL Mode Input Voltage
Output Current
V
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
BB
Sink/Source
1. For additional information, see Application Note AND8003/D.
Table 2. ATTRIBUTES
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Table 1. PIN DESCRIPTION
Parameter
PIN
D, D
Q, Q
V
V
V
NC
EP
BB
CC
EE
FUNCTION
ECL Data Inputs
ECL Data Outputs
Reference Voltage Output
Positive Supply
Negative Supply
No Connect
(DFN8 only) Thermal exposed pad must be connected to a
sufficient thermal conduit. Electrically connect to the most
negative supply (GND) or leave unconnected, floating open.
Characteristics
Pb−Free
Pb
http://onsemi.com
V
V
V
V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
EE
CC
EE
CC
Oxygen Index: 28 to 34
Condition 1
= 0 V
= 0 V
= 0 V
= 0 V
Charge Device Model
Human Body Model
2
Machine Model
V
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
I
I
 V
 V
Condition 2
CC
EE
UL 94 V−0 @ 0.125 in
> 500 V
> 100 V
Level 1
> 2 KV
75 KW
Value
N/A
47
41 to 44 ± 5%
−65 to +150
−40 to +85
41 to 44
35 to 40
Rating
± 0.5
100
190
130
185
140
129
265
265
−8
−6
50
84
8
6
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
mA
mA
mA
°C
°C
°C
V
V
V
V