S9S12GN16F0CLF Freescale Semiconductor, S9S12GN16F0CLF Datasheet - Page 1288

• Manufacturer Part Number: S9S12GN16F0CLF
• Description: 16-bit Microcontrollers - MCU 16-bit16k Flash 2k RAM
• Manufacturer: Freescale Semiconductor

Specifications of S9S12GN16F0CLF

• Rohs: yes
• Core: S12
• Processor Series: MC9S12G
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 25 MHz
• Program Memory Size: 16 KB
• Data Ram Size: 1024 B
• On-chip Adc: Yes
• Operating Supply Voltage: 3.13 V to 5.5 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: TSSOP-20
• Mounting Style: SMD/SMT

Package and Die Information
1290
Die Pad
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
Bond Post
MC9S12G Family Reference Manual,
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
Table D-1. Bondpad Coordinates
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
Die Pad
-1315.5
-1134.5
1120.5
1242.5
1412.5
1582.5
-964.5
-794.5
-660.5
-526.5
-404.5
-292.5
-190.5
-105.5
189.5
291.5
403.5
525.5
659.5
805.5
964.5
93.5
-0.5
Y Coordinate
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
Die Pad
-1347.5
-1139.5
-1022.5
-905.5
-788.5
-681.5
-574.5
Rev.1.23
Function
VDDX3
VSSX3
PAD[0]
PAD[8]
PAD[1]
PB[3]
PP[0]
PP[1]
PP[2]
PP[3]
PP[4]
PP[5]
PP[6]
PP[7]
PB[4]
PB[5]
PB[6]
PB[7]
PC[0]
PC[1]
PC[2]
PC[3]
PT[7]
PT[6]
PT[5]
PT[4]
PT[3]
PT[2]
PT[1]
PT[0]
Freescale Semiconductor