SPC5646CCF0MLT1 Freescale Semiconductor, SPC5646CCF0MLT1 Datasheet - Page 63

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SPC5646CCF0MLT1

Manufacturer Part Number
SPC5646CCF0MLT1
Description
32-bit Microcontrollers - MCU 3M FLASH,25 6K RAM,CSE
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of SPC5646CCF0MLT1

Rohs
yes
Core
e200
Processor Series
MPC5646C
Data Bus Width
32 bit
Maximum Clock Frequency
120 MHz
Program Memory Size
3 MB
Data Ram Size
256 KB
On-chip Adc
Yes
Operating Supply Voltage
0.3 V to 6.2 V
Operating Temperature Range
- 40 C to + 125 C
Package / Case
LQFP-208
Mounting Style
SMD/SMT
A/d Bit Size
10 bit, 12 bit
A/d Channels Available
33
Interface Type
CAN, I2C, SCI, SPI
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Number Of Programmable I/os
177
Number Of Timers
32
Program Memory Type
Flash
Supply Voltage - Max
6.2 V
Supply Voltage - Min
0.3 V
4.11.2
The product is monitored in terms of emission based on a typical application. This emission test conforms to the IEC61967-1
standard, which specifies the general conditions for EMI measurements.
4.11.3
Based on two different tests (ESD and LU) using specific measurement methods, the product is stressed in order to determine
its performance in terms of electrical sensitivity.
4.11.3.1
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according
to each pin combination. The sample size depends on the number of supply pins in the device (3 parts
test conforms to the AEC-Q100-002/-003/-011 standard.
Freescale
1
2
3
1
2
3
V
V
V
V
f
S
Symbol C
DD_LV
Symbol
ESD(HBM)
ESD(CDM)
CPU
EMI testing and I/O port waveforms per IEC 61967-1, -2, -4.
For information on conducted emission and susceptibility measurement (norm IEC 61967-4), please contact your
local marketing representative.
All values need to be confirmed during device validation.
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated
Circuits.
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification requirements. Complete DC parametric and functional testing shall be performed per applicable
device specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Data based on characterization results, not tested in production.
ESD(MM)
EMI
CC T Peak level
SR — Scan range
SR — Operating frequency
SR — LV operating voltages
Electromagnetic interference (EMI)
Absolute maximum ratings (electrical sensitivity)
Electrostatic discharge (ESD)
Electrostatic discharge voltage
(Human Body Model)
Electrostatic discharge voltage
(Machine Model)
Electrostatic discharge voltage
(Charged Device Model)
Parameter
Ratings
Table 31. EMI radiated emission measurement
Table 32. ESD absolute maximum ratings
MPC5646C Microcontroller DataSheet, Rev. 5.1
V
LQFP176 package
Test conforming to IEC 61967-2,
f
OSC
DD
= 5 V, T
= 40 MHz/f
T
conforming to AEC-Q100-002
T
conforming to AEC-Q100-003
T
conforming to AEC-Q100-011
A
A
A
A
= 25 °C
= 25 °C
= 25 °C
= 25 °C,
CPU
Conditions
Conditions
= 120 MHz
No PLL frequency
modulation
± 2% PLL frequency
modulation
1,2
Class
H1C
C3A
M2
1,2
0.150
Min
750 (corners)
Max value
Electrical Characteristics
Value
2000
1.28
(n+1) supply pin). This
200
500
Typ
120
1000 MHz
Max
3
14
18
3
Unit
MHz
Unit
dBµ
dBµ
V
V
V
V
63

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