MK40DN512ZVLL10 Freescale Semiconductor, MK40DN512ZVLL10 Datasheet - Page 22

• Manufacturer Part Number: MK40DN512ZVLL10
• Description: ARM Microcontrollers - MCU KINETIS 512K USB LCD
• Manufacturer: Freescale Semiconductor

Specifications of MK40DN512ZVLL10

• Rohs: yes
• Core: ARM Cortex M4
• Processor Series: K40
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 25 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 128 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: LQFP-100
• Mounting Style: SMD/SMT

General
5.4.1 Thermal operating requirements
5.4.2 Thermal attributes
1.
2.
3.
4.
22
Single-layer (1s)
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
—
—
—
Board type
Symbol
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
K40 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
Table 11. Thermal operating requirements
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to board
Thermal
resistance, junction
to case
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
Description
47
35
37
29
20
9
2
100 LQFP
Min.
–40
–40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor, Inc.
Max.
125
105
1
1
1
1
2
3
4
Notes
Unit
°C
°C