SX-SDPAN
802.11a/b/g/n SiP for Mobile Applications
The Silex SX-SDPAN (Qualcomm Atheros AR6233) is a third-
generation Wireless LAN solution, featuring dual-band 802.11n
plus Bluetooth. Based on the game-changing AR6003 Wireless LAN
chip, the SX-SDPAN brings 802.11n throughput, range and power
e ciency to portable devices including patient monitors, printers,
handheld terminals and more.
The SX-SDPAN integrates all WLAN and Bluetooth functionality in
a single package to support a low-cost PCB layout implementation.
5 GHz WLAN is supported with an external Front End Module
(FEM). Shared and dual antenna con gurations can be imple-
mented with a minimum number of external RF components.
Bene ts:
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Solution Highlights:
The SX-SDPAN incorporates all the features and performance of the
award winning Qualcomm Atheros ROCm® AR6003 solution, including:
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Highly Integrated Dual Band 802.11n plus Advanced Bluetooth 4.0 Solution
High RBOM integration enables design exibility and lowest cost
Smallest foot print for space constrained devices
Ultra low power consumption for extended battery life
Supports 40 MHz channels at 5 GHz allowing for highest
throughput for bandwidth intensive applications
Single-stream 802.11n for faster downloads, longer range, and
lower power consumption
Bluetooth 3.0+HS and 4.0 Low Energy
High level of RF integration enables direct antenna connection
through separate 2.4 GHz WLAN and Bluetooth antenna ports
Flexible dual-band solution with 5 GHz front end module (FEM);
shared and dual antenna con gurations supported
Highest level of on-chip integration using CMOS technology
- Radio/MAC/Baseband
- Patented Qualcomm Atheros E cient Power Ampli er
- Integrated power management unit
Qualcomm Atheros Universal Wireless Cooperation for
enhanced Wi-Fi/Bluetooth Coexistence
(EPA™) for high transmitter output power
Features:
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Speci cations:
Target Applications:
The SX-SDPAN is ideal for any high volume portable device
where there is a requirement to achieve the lowest BOM cost
or smallest foot print. Implementation of a System-in-Package
solution is recommended for companies that have RF hardware
expertise. Software driver and supplicant development is also
generally required.
Product Name
Chipset
Operating Voltage
Dimensions
Bluetooth Speci cations
Storage Temperature
Operating Temperature
IEEE 802.11a/b/g/n 2.4/5 GHz
Bluetooth 3.0+HS and 4.0 Low Energy
Integrated CMOS E cient Power Ampli er (EPA™), LNA
Adaptive radio biasing for low-power or high-performance modes
Industry-leading receive sensitivity
No external EEPROM required for RF calibration
Integrated RISC processor
Support for industry standard QoS schemes
(802.11e, WMM, WMM-PS)
Hardware accelerated security, including WAPI (China)
SX-SDPAN-2830BT
Qualcomm Atheros AR6233
VDD 3.3V, AVDD 1.8v
8.4 x 8.4 x 1.1 mm
LGA package with 650um pitch pads
BT3.0+HS, BT4.0, Class 1.5
-45 to +125 degrees C
-20 to +85 degrees C
PN: 141-00207-170
REV C. 20120905