M24512-DFDW6TP STMicroelectronics, M24512-DFDW6TP Datasheet

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M24512-DFDW6TP

Manufacturer Part Number
M24512-DFDW6TP
Description
EEPROM 512Kit I2C EEProm 128kB 1 MHz 1.7 5.5V
Manufacturer
STMicroelectronics
Datasheet

Specifications of M24512-DFDW6TP

Rohs
yes
Features
September 2012
This is information on a product in full production.
Compatible with all I
– 1 MHz
– 400 kHz
– 100 kHz
Memory array:
– 512 Kbit (64 Kbytes) of EEPROM
– Page size: 128 bytes
– Additional Write lockable page
Single supply voltage and high speed:
– 1 MHz clock from 1.7 V to 5.5 V
Write:
– Byte Write within 5 ms
– Page Write within 5 ms
Operating temperature range: from -40 °C up
to +85 °C
Random and sequential Read modes
Write protect of the whole memory array
Enhanced ESD/Latch-Up protection
More than 4 million Write cycles
More than 200-year data retention
Packages:
– RoHS compliant and halogen-free
(M24512-D order codes)
(ECOPACK
®
)
2
C bus modes:
Doc ID 16459 Rev 26
512-Kbit serial I²C bus EEPROM
M24512-DR M24512-DF
M24512-W M24512-R
TSSOP8 (DW)
169 mil width
150 mil width
WLCSP (CS)
UFDFPN8
SO8 (MN)
(MC)
Datasheet
production data
www.st.com
1/40
1

Related parts for M24512-DFDW6TP

M24512-DFDW6TP Summary of contents

Page 1

... Memory array: – 512 Kbit (64 Kbytes) of EEPROM – Page size: 128 bytes – Additional Write lockable page (M24512-D order codes) ■ Single supply voltage and high speed: – 1 MHz clock from 1 5.5 V ■ Write: – Byte Write within 5 ms – ...

Page 2

... Operating supply voltage Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Write Identification Page (M24512-D only Lock Identification Page (M24512-D only ECC (Error Correction Code) and Write cycling . . . . . . . . . . . . . . . . . . 18 Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 19 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Doc ID 16459 Rev 26 ...

Page 3

... M24512-W M24512-R M24512-DR M24512-DF 5.2.2 5.2.3 5.3 Read Identification Page (M24512-D only 5.4 Read the lock status (M24512-D only Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 10 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Doc ID 16459 Rev 26 ...

Page 4

... Table 10. Input parameters Table 11. Cycling performance by groups of four bytes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 12. Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 13. DC characteristics (M24512-W, device grade Table 14. DC characteristics (M24512-R, M24512-DR, device grade Table 15. DC characteristics (M24512-DF, device grade 6 Table 16. 400 kHz AC characteristics Table 17. ...

Page 5

... Figure 16. SO8N – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 34 Figure 17. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package outline . . . . . . . 35 Figure 18. M24512-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline . . . . . . . . 36 bus = 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 C bus = 1MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 ...

Page 6

... The M24512 is a 512-Kbit I Memory) organized × 8 bits. The M24512-W can operate with a supply voltage from 2 5.5 V, the M24512-R and M24512-DR can operate with a supply voltage from 1 5.5 V and the M24512-DF can operate with a supply voltage from 1 5.5 V. All these devices operate with a clock frequency of 1 MHz (or less) over an ambient temperature range of – ...

Page 7

... M24512-W M24512-R M24512-DR M24512-DF Figure 3. WLCSP connections for the M24512-DFCS6TP/K (top view, marking side, with balls on the underside) Caution: As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet (UV) light, EEPROM dice delivered in wafer form or in WLCSP package by STMicroelectronics must never be exposed to UV light ...

Page 8

... When Write Control (WC) is driven high, device select and address bytes are acknowledged, Data bytes are not acknowledged. 2.5 V (ground the reference for the V SS 8/40 M24512-W M24512-R M24512-DR M24512- shown in Figure 4. When not connected (left floating), these inputs M24xxx supply voltage. ...

Page 9

... M24512-W M24512-R M24512-DR M24512-DF 2.6 Supply voltage (V 2.6.1 Operating supply voltage V Prior to selecting the memory and issuing instructions to it, a valid and stable V within the specified [V in Section 8: DC and AC recommended to decouple the 100 nF) close to the V This voltage must remain stable and valid until the end of the transmission of the instruction and, for a write instruction, until the completion of the internal write cycle (t 2 ...

Page 10

... Memory organization 3 Memory organization The memory is organized as shown below. Figure 5. Block diagram 10/40 M24512-W M24512-R M24512-DR M24512-DF Doc ID 16459 Rev 26 ...

Page 11

... M24512-W M24512-R M24512-DR M24512-DF 4 Device operation The device supports the I data on to the bus is defined transmitter, and any device that reads the data receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device. A data transfer can only be initiated by the bus master, which will also provide the serial clock for synchronization ...

Page 12

... Serial Data (SDA) after sending eight bits of data. During the 9 acknowledge the receipt of the eight data bits. 12/40 M24512-W M24512-R M24512-DR M24512-DF th clock pulse period, the receiver pulls Serial Data (SDA) low to Doc ID 16459 Rev 26 ...

Page 13

... M24512-W M24512-R M24512-DR M24512-DF 4.5 Device addressing To start communication between the bus master and the slave device, the bus master must initiate a Start condition. Following this, the bus master sends the device select code, shown in Table 2(on Serial Data (SDA), most significant bit first). ...

Page 14

... During the internal Write cycle, Serial Data (SDA) is disabled internally, and the device does not respond to any requests. If the Write Control input (WC) is driven High, the Write instruction is not executed and the accompanying data bytes are not acknowledged, as shown in 14/40 M24512-W M24512-R M24512-DR M24512-DF Figure A13 A12 A11 ...

Page 15

... M24512-W M24512-R M24512-DR M24512-DF 5.1.1 Byte Write After the device select code and the address bytes, the bus master sends one data byte. If the addressed location is Write-protected, by Write Control (WC) being driven high, the device replies with NoAck, and the location is not modified. If, instead, the addressed location is not Write-protected, the device replies with Ack ...

Page 16

... The transfer is terminated by the bus master generating a Stop condition. Figure 8. Write mode sequences with (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) 16/40 M24512-W M24512-R M24512-DR M24512-DF ACK ACK Dev sel Byte addr Byte addr R/W ACK ACK Dev sel ...

Page 17

... If the Identification page is locked, the data bytes transferred during the Write Identification Page instruction are not acknowledged (NoAck). 5.1.4 Lock Identification Page (M24512-D only) The Lock Identification Page instruction (Lock ID) permanently locks the Identification page in Read-only mode. The Lock ID instruction is similar to Byte Write (into memory array) with the following specific conditions: ● ...

Page 18

... A group of four bytes is located at addresses [4*N, 4*N+1, 4*N+2, 4*N+3], where integer. 18/40 M24512-W M24512-R M24512-DR M24512-DF ( consequence, the maximum cycling budget is Table 11: Cycling performance by groups of four Doc ID 16459 Rev 26 (a) ...

Page 19

... M24512-W M24512-R M24512-DR M24512-DF 5.1.6 Minimizing Write delays by polling on ACK The maximum Write time (t parameters, but the typical time is shorter. To make use of this, a polling sequence can be used by the bus master. The sequence, as shown in ● Initial condition: a Write cycle is in progress. ● Step 1: the bus master issues a Start condition followed by a device select code (the first byte of the new instruction). ● ...

Page 20

... Figure 10. Read mode sequences Current Address Read Random Address Read Sequential Current Read Sequention Random Read 20/40 M24512-W M24512-R M24512-DR M24512-DF ACK NO ACK Dev sel Data out R/W ACK ACK Dev sel * Byte addr Byte addr R/W ACK ACK Dev sel Data out 1 ...

Page 21

... Read Identification Page (M24512-D only) The Identification Page (128 bytes additional page which can be written and (later) permanently locked in Read-only mode. The Identification Page can be read by issuing an Read Identification Page instruction. This instruction uses the same protocol and format as the Random Address Read (from memory array) with device type identifier defined as 1011b ...

Page 22

... Initial delivery state 5.4 Read the lock status (M24512-D only) The locked/unlocked status of the Identification page can be checked by transmitting a specific truncated command [Identification Page Write instruction + one data byte] to the device. The device returns an acknowledge bit if the Identification page is unlocked, otherwise a NoAck bit if the Identification page is locked. ...

Page 23

... M24512-W M24512-R M24512-DR M24512-DF 7 Maximum rating Stressing the device outside the ratings listed in the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the operating sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability ...

Page 24

... For devices identified by process letter K. Table 9. AC measurement conditions Symbol C Load capacitance bus SCL input rise/fall time, SDA input fall time Input levels Input and output timing reference levels 24/40 M24512-W M24512-R M24512-DR M24512-DF Parameter Parameter Parameter Parameter Doc ID 16459 Rev 26 Min. Max. Unit 2.5 5.5 V – ...

Page 25

... M24512-W M24512-R M24512-DR M24512-DF Figure 11. AC measurement I/O waveform Table 10. Input parameters Symbol C Input capacitance (SDA Input capacitance (other pins Input impedance (E2, E1, E0, WC Characterized only, not tested in production. 2. E2, E1, E0 input impedance when the memory is selected (after a Start condition). ...

Page 26

... DC and AC parameters Table 13. DC characteristics (M24512-W, device grade 6) Symbol Parameter Input leakage current I (SCL, SDA, E2, E1, LI E0) Output leakage I LO current I Supply current (Read Supply current (Read Supply current (Write) During t CC0 Standby supply I CC1 current Input low voltage ...

Page 27

... M24512-W M24512-R M24512-DR M24512-DF Table 14. DC characteristics (M24512-R, M24512-DR, device grade 6) Symbol Parameter Input leakage current E1, E2, SCL, SDA) I Output leakage current LO I Supply current (Read Supply current (Write) CC0 I Standby supply current CC1 Input low voltage V IL (SCL, SDA, WC) ...

Page 28

... DC and AC parameters Table 15. DC characteristics (M24512-DF, device grade 6) Symbol Parameter Input leakage current I LI (E1, E2, SCL, SDA) I Output leakage current LO I Supply current (Read Supply current (Read Supply current (Write) CC0 I Standby supply current CC1 Input low voltage V IL ...

Page 29

... M24512-W M24512-R M24512-DR M24512-DF Table 16. 400 kHz AC characteristics Symbol Alt SCL t t CHCL HIGH t t CLCH LOW ( QL1QL2 XH1XH2 XL1XL2 DXCH SU:DAT t t CLDX HD:DAT ( CLQX DH ( CLQV CHDL SU:STA t t DLCL HD:STA ...

Page 30

... CC 5. WC=0 set up time condition to enable the execution of a WRITE command. 6. WC=0 hold time condition to enable the execution of a WRITE command. 7. 50100 ns for devices identified by process letter A. 30/40 M24512-W M24512-R M24512-DR M24512-DF Parameter Clock frequency Clock pulse width high Clock pulse width low Input signal rise time ...

Page 31

... M24512-W M24512-R M24512-DR M24512-DF Figure 12. Maximum Figure 13. Maximum value versus bus parasitic capacitance (C bus C bus at maximum frequency f value versus bus parasitic capacitance C bus C bus at maximum frequency f Doc ID 16459 Rev 26 DC and AC parameters ) for bus = 400 kHz C ) for ...

Page 32

... DC and AC parameters Figure 14. AC waveforms 32/40 M24512-W M24512-R M24512-DR M24512-DF Doc ID 16459 Rev 26 ...

Page 33

... M24512-W M24512-R M24512-DR M24512-DF 9 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. Figure 15. TSSOP8 – 8-lead thin shrink small outline, package outline 1 ...

Page 34

... SO8N – 8 lead plastic small outline, 150 mils body width, package data Symbol ccc Values in inches are converted from mm and rounded to four decimal digits. 34/40 M24512-W M24512-R M24512-DR M24512-DF A ccc millimeters Typ Min Max 1.750 0.100 0.250 1.250 0.280 0.480 0.170 0.230 ...

Page 35

... M24512-W M24512-R M24512-DR M24512-DF Figure 17. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package outline 1. Drawing is not to scale. 2. The central pad (area the above illustration) is internally pulled to V connected to any other voltage or signal line on the PCB, for example during the soldering process. ...

Page 36

... Package mechanical data Figure 18. M24512-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline 1. Drawing is not to scale. 36/40 M24512-W M24512-R M24512-DR M24512-DF Doc ID 16459 Rev 26 ...

Page 37

... M24512-W M24512-R M24512-DR M24512-DF Table 21. M24512-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package mechanical data Symbol A 0.540 A1 0.190 A2 0.350 b 0.270 D 1.271 E 1.937 e 1.000 e1 0.866 e2 0.500 e3 0.433 F 0.202 G 0.469 N 8.000 aaa 0.110 bbb 0.110 ccc 0.110 ddd 0.060 eee 0.060 1. Values in inches are converted from mm and rounded to four decimal digits. ...

Page 38

... Manufacturing technology code 1. RoHS-compliant and halogen-free (ECOPACK2 2. The process letters apply to WLCSP devices only. The process letters appear on the device package (marking) and on the shipment box. Please contact your nearest ST Sales Office for further information. 38/40 M24512-W M24512-R M24512-DR M24512-DF M24512 - (1) (1) (1) ® ...

Page 39

... Figure 14. 24 Updated Section 1: Description. Datasheet split into: – M24512-125 datasheet for automotive products (range 3), – M24512-W M24512-R M24512-DR M24512-DF for standard products (range 6, this datasheet rev 25). Deleted: – SO8W package – UFDFPN8 (MLP8): MB version package – WLCSP (KA die) dimensions 25 Added: – ...

Page 40

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 40/40 M24512-W M24512-R M24512-DR M24512-DF Please Read Carefully: © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies www ...

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