AT24C08C-XHM-B Atmel, AT24C08C-XHM-B Datasheet - Page 21
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AT24C08C-XHM-B
Manufacturer Part Number
AT24C08C-XHM-B
Description
EEPROM 8K (1024x8) 2-WIRE NiPdAu, 1.7V
Manufacturer
Atmel
Datasheet
1.AT24C08C-SSHM-T.pdf
(24 pages)
Specifications of AT24C08C-XHM-B
Rohs
yes
Factory Pack Quantity
100
12.4
5TS1 – SOT23
packagedrawings@atmel.com
Package Drawing Contact:
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
2. The package top may be smaller than the package bottom. Dimensions D and E1
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
mm from the lead tip.
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
SEATING
PLANE
E1
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
TITLE
1
5
TOP VIEW
b
SIDE VIEW
e1
D
2
e
3
4
A2
A1
E
A
Atmel AT24C04C/08C [DATASHEET]
SYMBOL
A1
A2
E1
L1
e1
A
c
D
E
e
b
END VIEW
C
0.00
0.70
0.08
0.30
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
-
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
GPC
TSZ
C
L1
L
0.90
NOM
-
-
-
-
DRAWING NO.
8787C–SEEPR–7/12
1.00
0.10
1.00
0.20
0.50
MAX
5TS1
NOTE
1,2
1,2
1,2
3,4
3
5/31/12
REV.
D
21