AT24C08AN-10SU-1.8 Atmel, AT24C08AN-10SU-1.8 Datasheet
AT24C08AN-10SU-1.8
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AT24C08AN-10SU-1.8 Summary of contents
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... Die Sales: Wafer Form, Waffle Pack and Bumped Wafers Description The AT24C01A/02/04/08A/16A provides 1024/2048/4096/8192/16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential ...
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Absolute Maximum Ratings Operating Temperature..................................–55°C to +125°C Storage Temperature .....................................–65°C to +150°C Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Figure 1. Block Diagram AT24C01A/02/04/08A/16A 2 ...
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... AT24C02, 2K SERIAL EEPROM: Internally organized with 32 pages of 8 bytes each, the 2K requires an 8-bit data word address for random word addressing. AT24C04, 4K SERIAL EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9-bit data word address for random word addressing. AT24C08A, 8K SERIAL EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit data word address for random word addressing ...
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Table 3. Pin Capacitance Applicable over recommended operating range from T Symbol Test Condition C Input/Output Capacitance (SDA) I/O C Input Capacitance ( Note: 1. This parameter is characterized and is not 100% tested. Table ...
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Table 5. AC Characteristics Applicable over recommended operating range from TTL Gate and 100 pF (unless otherwise noted) Symbol Parameter f Clock Frequency, SCL SCL t Clock Pulse Width Low LOW t Clock Pulse Width High ...
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... Figure 5 on page 8). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The AT24C01A/02/04/08A/16A features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations ...
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Bus Timing Figure 2. SCL: Serial Clock, SDA: Serial Data I/O Write Cycle Timing Figure 3. SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT WORDn Note: 1. The write cycle time t is the time from a ...
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Figure 5. Start and Stop Definition Figure 6. Output Acknowledge AT24C01A/02/04/08A/16A 8 0180Z1–SEEPR–5/07 ...
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... The next 3 bits are the A2, A1 and A0 device address bits for the 1K/2K EEPROM. These 3 bits must compare to their corresponding hard-wired input pins. The 4K EEPROM only uses the A2 and A1 device address bits with the third bit being a memory page address bit. The two device address bits must compare to their corre- sponding hard-wired input pins ...
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... SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a ran- dom address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “ ...
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Figure 7. Device Address Figure 8. Byte Write Figure 9. Page Write (* = DON’T CARE bit for 1K) 0180Z1–SEEPR–5/07 MSB 8K 16K 11 ...
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Figure 10. Current Address Read Figure 11. Random Read (* = DON’T CARE bit for 1K) Figure 12. Sequential Read AT24C01A/02/04/08A/16A 12 0180Z1–SEEPR–5/07 ...
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... Green Package + RoHS compliant, with NiPdAu Lead Finish. 4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing. 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" ...
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... AC and DC characteristics table. 2. “U” designates Green Package + RoHS compliant. 3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing. 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" ...
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... Green Package + RoHS compliant, with NiPdAu Lead Finish. 4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing. 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" ...
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... AT24C08A Ordering Information Ordering Code (2) AT24C08A-10PU-2.7 (2) AT24C08A-10PU-1.8 (2) AT24C08AN-10SU-2.7 (2) AT24C08AN-10SU-1.8 (2) AT24C08A-10TU-2.7 (2) AT24C08A-10TU-1.8 (2) AT24C08AY1-10YU-1.8 (Not recommended for new design) (3) AT24C08AY6-10YH-1.8 (2 AT24C08AU2-10UU-1.8 (4) AT24C08A-W1.8-11 Notes: 1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table. 2. “U” designates Green Package + RoHS compliant. ...
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... Green Package + RoHS compliant, with NiPdAu Lead Finish. 4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial EEPROM Marketing. 8P3 8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" ...
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Packaging Information 8P3 – PDIP Top View PLCS Side View Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information. 2. Dimensions A and L are measured ...
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JEDEC SOIC e Side View Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R 0180Z1–SEEPR–5/07 1 ...
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TSSOP Pin 1 indicator this corner N Top View Side View Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, ...
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MAP D E Top View Side View 2325 Orchard Parkway San Jose, CA 95131 R 0180Z1–SEEPR–5/ End View A SYMBOL TITLE 8Y1, 8-lead (4.90 x 3.00 mm ...
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Mini-MAP (MLP 2x3 mm) D Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm ...
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SOT23 E1 1 Seating Plane NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB, for additional information. 2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, ...
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E Pin 1 Mark this corner D Top View Bottom View Notes: 1. These drawings are for general information only. No JEDEC Drawing to refer ...
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PIN 1 BALL PAD CORNER Top View PIN 1 BALL PAD CORNER 1 2 (d1 (e1) Bottom View 8 SOLDER BALLS 1. Dimension “b” is measured at the maximum solder ball diameter. This ...
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Revision History Doc. No. 0180Z1 AT24C01A/02/04/08A/16A 26 Date Comments 5/2007 Implemented revision history. Changed formatting on page 16 0180Z1–SEEPR–5/07 ...
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