MAX13032EETE+T Maxim Integrated Products, MAX13032EETE+T Datasheet - Page 13

• Manufacturer Part Number: MAX13032EETE+T
• Description: IC LEVEL TRANS 6CH 16-TQFN-EP
• Manufacturer: Maxim Integrated Products

Specifications of MAX13032EETE+T

• Logic Function: Translator, Bidirectional
• Number Of Bits: 1
• Input Type: Logic
• Output Type: Logic
• Data Rate: 100Mbps
• Number Of Channels: 6
• Number Of Outputs/channel: 1
• Differential - Input:output: No/No
• Propagation Delay (max): 6.5ns
• Voltage - Supply: 2.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TQFN Exposed Pad
• Supply Voltage: 2.2 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The MAX13035E features a CLK_RET output that returns
the clock signal applied to CLK_V
CLK_V
difference being that CLK_V
V
Use standard high-speed layout practices when laying
out a board with the MAX13030E–MAX13035E. For
example, to minimize line coupling, place all other signal
lines not connected to the MAX13030E–MAX13035E at
least 1x the substrate height of the PCB away from the
input and output lines of the MAX13030E–MAX13035E.
To reduce ripple and the chance of introducing data
errors, bypass V
ic capacitors. Place all capacitors as close as possible
to the power-supply inputs. For full ESD protection,
bypass V
close as possible to the V
The MAX13030E–MAX13035E bidirectional level trans-
lators can operate as a unidirectional device to trans-
late signals without inversion. These devices provide
the smallest solution (UCSP package) for unidirectional
level translation without inversion.
Due to the architecture of the MAX13030E–
MAX13035E, it is not recommended to use external
pullup or pulldown resistors on the bus. In certain appli-
cations, the use of external pullup or pulldown resistors
is desired to have a known bus state when there is no
active driver on the bus. For example, this may happen
when interfacing to a memory card slot with no memory
card inserted. The MAX13030E–MAX13035E include
internal pullup current sources that set the bus state
when the device is enabled. In shutdown mode,
the state of I/O V
the selected part version (see Ordering Information/
Selector Guide for further information).
CC
6-Channel High-Speed Logic-Level Translators
side of CLK_RET (see the Functional Diagram ).
CC
Unidirectional vs. Bidirectional Level
CC
are identical to the other I/O channels, the only
Use with External Pullup/Pulldown
with a 1µF ceramic capacitor located as
L
Application Information
and V
______________________________________________________________________________________
CC_
Layout Recommendations
Power-Supply Decoupling
CC
and I/O V
Clock Return (CLK_RET)
CC
to ground with 0.1µF ceram-
CC
input.
is internally tied to the
L_
is dependent on
L
. CLK_V
Translator
Resistors
L
and
The MAX13030E–MAX13035E are designed to pass
open-drain as well as CMOS push-pull signals. When
used with open-drain signaling, the rise time is domi-
nated by the interaction of the internal pullup current
source and the parasitic load capacitance. The
MAX13030E–MAX13035E include internal rise time
accelerators to speed up transitions, eliminating any
need for external pullup resistors.
SD, MiniSD, MMC and similar types of cards provide
detection of a card through a pullup resistor on one of
the DAT lines, or by use of a mechanical switch. This
pullup resistor is internal to the memory card itself. The
MAX13030E–MAX13035E only support detection of
a memory card through a mechanical switch, and it
is recommended that the internal resistor for card
detection be switched off by the command interface.
For example, when using SD cards, the command
SET_CLR_CARD_DETECT (ACMD42) disables this
resistor.
For the latest application details on UCSP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profiles, as well as the latest information on reliabil-
ity testing results, go to Maxim’s web site at
www.maxim-ic.com/ucsp to find the Application Note:
UCSP – A Wafer-Level Chip-Scale Package.
Process: BiCMOS
UCSP Applications Information
Open-Drain Signaling
Chip Information
SD Card Detection
13