MC10H124FNR2G ON Semiconductor, MC10H124FNR2G Datasheet - Page 5

• Manufacturer Part Number: MC10H124FNR2G
• Description: IC TRNSLATR QUAD TTL-MECL 20PLCC
• Manufacturer: ON Semiconductor
• Series: 10Hr

Specifications of MC10H124FNR2G

• Logic Function: Translator
• Number Of Bits: 4
• Input Type: TTL
• Output Type: MECL
• Number Of Channels: 4
• Number Of Outputs/channel: 1
• Differential - Input:output: No/No
• Propagation Delay (max): 2.65ns
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 75°C
• Package / Case: 20-PLCC
• Supply Voltage: 4.75 V ~ 5.25 V
• Logic Family: ECL
• Logical Function: Translator
• Technology: ECL
• High Level Output Current: -50mA
• Low Level Output Current: 50mA
• Operating Supply Voltage (typ): -5.2/5V
• Abs. Propagation Delay Time: 3.1ns
• Mounting: Surface Mount
• Pin Count: 20
• Operating Temperature (min): 0C
• Operating Temperature (max): 75C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MC10H124FNR2GOS; MC10H124FNR2GOS; MC10H124FNR2GOSTR

NOTES:
C
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
7. DIMENSION H DOES NOT INCLUDE DAMBAR
−L−
1982.
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
DATUM −T−, SEATING PLANE.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.010 (0.250)
20
Z
G1
S
G
T
1
−N−
L-M
S
A
R
V
N
VIEW S
S
−M−
E
Y BRK
J
0.007 (0.180)
0.007 (0.180)
−T−
W
0.004 (0.100)
SEATING
PLANE
M
M
PACKAGE DIMENSIONS
D
D
T
T
L-M
L-M
DIM
http://onsemi.com
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
20 LEAD PLLC
CASE 775−02
S
S
0.385
0.385
0.165
0.090
0.013
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.310
0.040
MIN
ISSUE F
−−−
0.050 BSC
2
B
N
N
INCHES
_
Z
S
S
5
0.395
0.395
0.180
0.110
0.021
0.032
0.356
0.356
0.048
0.048
0.056
0.020
0.330
VIEW D−D
MAX
−−−
−−−
10
−−−
U
0.007 (0.180)
_
K1
X
MILLIMETERS
MIN
9.78
9.78
4.20
2.29
0.33
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
7.88
1.02
−−−
0.007 (0.180)
1.27 BSC
2
_
K
10.03
10.03
MAX
M
4.57
2.79
0.53
0.81
9.04
9.04
1.21
1.21
1.42
0.50
8.38
−−−
−−−
10
−−−
_
T
VIEW S
L-M
M
G1
T
S
L-M
F
H
N
S
0.010 (0.250)
S
0.007 (0.180)
N
0.007 (0.180)
S
S
M
T
M
L-M
T
T
L-M
L-M
S
S
N
S
S
N
N
S
S