MC100EPT20DTG ON Semiconductor, MC100EPT20DTG Datasheet - Page 3

• Manufacturer Part Number: MC100EPT20DTG
• Description: IC XLATOR TTL/CMOS-PECL 8TSSOP
• Manufacturer: ON Semiconductor
• Series: 100EPTr

Specifications of MC100EPT20DTG

• Logic Function: Translator
• Number Of Bits: 1
• Input Type: LVCMOS, LVTTL
• Output Type: LVPECL
• Number Of Channels: 1
• Number Of Outputs/channel: 1
• Differential - Input:output: No/Yes
• Propagation Delay (max): 0.45ns
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP
• Supply Voltage: 3 V ~ 3.6 V
• Logic Type: Translator
• Logic Family: ECL
• Translation: LVCMOS/LVTTL to LVPECL
• High Level Output Current: - 50 mA
• Low Level Output Current: 50 mA
• Propagation Delay Time: 0.45 ns @ 3 V to 3.6 V
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Logical Function: Translator
• Technology: ECL
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSSOP
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Abs. Propagation Delay Time: 490ps
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Data Rate: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC100EPT20DTGOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
2. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 3. MAXIMUM RATINGS
Symbol
V
V
I
TA
T
q
q
q
q
q
T
q
out
stg
JA
JC
JA
JC
JA
sol
JC
CC
I
Power Supply
Input Voltage
Output Current
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance (Junction−to−Ambient)
Wave Solder
Thermal Resistance (Junction−to−Case)
Parameter
Pb−Free
Pb
http://onsemi.com
GND = 0 V
GND = 0 V
Continuous
Surge
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
Standard Board
0 lfpm
500 lfpm
<2 to 3 sec @ 248°C
<2 to 3 sec @ 260°C
(Note 2)
Condition 1
3
V
SOIC−8
SOIC−8
SOIC−8
TSSOP−8
TSSOP−8
TSSOP−8
DFN8
DFN8
DFN8
I
 V
Condition 2
CC
−65 to +150
−40 to +85
41 to 44
41 to 44
35 to 40
Rating
100
190
130
185
140
129
265
265
50
84
6
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
mA
mA
°C
°C
°C
V
V