100ELT22MX Fairchild Semiconductor, 100ELT22MX Datasheet

TRANSLATOR TTL-DIFF PECL 8SOIC

100ELT22MX

Manufacturer Part Number
100ELT22MX
Description
TRANSLATOR TTL-DIFF PECL 8SOIC
Manufacturer
Fairchild Semiconductor
Series
100ELr
Datasheet

Specifications of 100ELT22MX

Logic Function
Translator
Number Of Bits
2
Input Type
TTL
Output Type
PECL
Number Of Channels
2
Number Of Outputs/channel
1
Differential - Input:output
Yes/No
Propagation Delay (max)
0.6ns
Voltage - Supply
4.2 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Supply Voltage
4.2 V ~ 5.5 V
Logic Family
ECL
Logical Function
Translator
Technology
ECL
High Level Output Current
-50mA
Low Level Output Current
50mA
Translation
TTL to PECL
Operating Supply Voltage (typ)
5V
Package Type
SOIC N
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.2V
Abs. Propagation Delay Time
600ps
Mounting
Surface Mount
Pin Count
8
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Rate
-
Lead Free Status / Rohs Status
Compliant
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Lam, HH
E-mail: HH.Lam@fairchildsemi.com
Phone: 604 850 2392
Implementation of change:
Expected 1st Device Shipment Date: 2008/11/14
Earliest Year/Work Week of Changed Product: 0847
Change Type Description: Mold Compound
Description of Change (From): NMSON 8L and NQSOP 16/20/24L packages assembly at all
FSC approved manufacturing locations (Unisem) using non Green mold compound as shown in
table 1.
Description of Change (To): NMSON 8L and NQSOP 16/20/24L packages assembly at all FSC
approved manufacturing locations (Unisem) using Green mold compound as shown in table 2.
Reason for Change : 1. Current mold compound supplier has announce the discontinuance of
LSA mold compound EME6730B. Based on current run rates there is a potential for a mold
compound material shortage if this PCN is not approved within the timeframe noted above. 2.
Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is dedicated to being a
good corporate citizen. All Fairchild Semiconductor products are 2nd level interconnect
lead-free and RoHS compliance. The referenced material changes have been made to provide a
'Full Green' (Halogen Free Flame Retardant) package. For additional details on the corporate
wide green initiative please visit our Web site at :
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
affected products remain un-changed. Green products will be fully compliant to all published
data sheet specifications and will be interchangeable with current non-green product. Quality
and reliability will remain at the highest standards already demonstrated with Fairchild's
existing products.
Qual/REL Plan Numbers : Q20070249
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Po, Peter
E-mail: Peter.Po@notes.fairchildsemi.com
Phone: 604 850 2267
Date Issued On : 2008/08/27
Date Created : 2008/07/21
PCN# : Q3083001
Pg. 1

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100ELT22MX Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Qualification : All the reliability tests defined in this qual plan completed with no failures. Therefore Unisem is qualified to assembly NMSON 8L and NQSOP 16/20/24L packages. Change From Change To Results/Discussion for Qual Plan NumberQ20070249 Test: (Autoclave) Lot Device ...

Page 3

... Results 0/276 0/353 Results 0/353 100EL11M 100ELT22MX 100LVEL11M 100LVEL16M 74ACTQ543QSCX 74LVX3245QSC 74LVXC3245QSCX 74LVXC4245QSC CGS3312MX CGS3318M FAN5009MX FIN1018MX FIN1027MX FIN1028M FMS6141CSX FSAL200QSC FSAV331QSCX FSAV450QSCX FST3125QSC FST3245QSC FST3257QSCX Failure Code ...

Page 4

FST3384QSCX FSUSB22QSCX GTLP1B151M FST3384QSC FSUSB22QSC GTLP2T152MX FST6800QSCX GTLP1B151MX GTLP2T152M Pg. 4 ...

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