FT311D-32L1C-T FTDI, FT311D-32L1C-T Datasheet - Page 34

• Manufacturer Part Number: FT311D-32L1C-T
• Description: USB Interface IC USB Android Host Controller IC LQFP32
• Manufacturer: FTDI

Specifications of FT311D-32L1C-T

• Rohs: yes
• Product: USB 2.0
• Interface Type: I2C, UART, USB
• Operating Supply Voltage: 0 V to 3.63 V
• Operating Supply Current: 25 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: LQFP-32

Table 9.1 Reflow Profile Parameter Values
Table 9.2 Package Reflow Peak Temperature
SnPb Eutectic and Pb free (non green material)
Pb Free (green material) = 260 +5/-0 deg C
Time Maintained Above Critical Temperature
Time within 5°C of actual Peak Temperature
Time for T= 25°C to Peak Temperature, T
Average Ramp Up Rate (T
- Temperature Max (T
- Temperature Min (T
- Time (t
Peak Temperature (T
- Temperature (T
Package Thickness
Profile Feature
Ramp Down Rate
- Time (t
≥
< 2.5 mm
Preheat
s
Copyright © 2012 Future Technology Devices International Limited
2.5 mm
Min to t
(t
T
L
p
:
)
L
)
s
Max)
s
s
L
)
Min.)
Max.)
s
p
)
to T
p
)
p
DS
Pb Free Solder Process
_FT311D
Volume mm3 < 350
(green material)
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
235 +5/-0 deg C
220 +5/-0 deg C
30 to 40 seconds
8 minutes Max.
150°C
200°C
217°C
260°C
USB ANDROID HOST IC Datasheet
Document No.: FT_000660 Clearance No.: FTDI# 305
SnPb Eutectic and Pb free (non
green material) Solder Process
Volume mm3 >=350
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
220 +5/-0 deg C
220 +5/-0 deg C
20 to 40 seconds
see
6 minutes Max.
Figure 9-5
100°C
150°C
183°C
Version 1.0
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