VNC1L-1A-TRAY FTDI, VNC1L-1A-TRAY Datasheet - Page 28

• Manufacturer Part Number: VNC1L-1A-TRAY
• Description: USB Interface IC USB Vinculum Host /Dev Ctrl IC LQFP-48
• Manufacturer: FTDI

Specifications of VNC1L-1A-TRAY

• Product Category: USB Interface IC
• Rohs: yes
• Operating Supply Voltage: 3.3 V
• Operating Supply Current: 25 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: LQFP-48
• Minimum Operating Temperature: - 40 C
• Factory Pack Quantity: 250

8.2 Solder Reflow Profile
The recommended solder reflow profile is shown in Figure 8.2.
Figure 8.2 VNC1L Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 8.1. Values are shown for both
a completely Pb free solder process (i.e. VNC1L is used with Pb free solder) and for a non-Pb free solder
process (i.e. VNC1L is used with non-Pb free solder).
Table 8.1 Reflow Profile Parameter Value
Profile Feature
Preheat
- Temperature Min (T
- Temperature Max (T
- Time (t
Temperature T
- Temperature (T
- Time (t
Temperature (t
Time for T= 25°C to Peak Temperature, T
Average Ramp Up Rate (T
Time Maintained Above Critical
Peak Temperature (T
Time within 5°C of actual Peak
Ramp Down Rate
S
L
)
25
Min to t
T
T
p
L
T Max
T Min
S
S
L
P
:
)
L
S
)
Max)
Copyright © 2009 Future Technology Devices International Limited
S
P
S
)
Min.)
Max.)
s
to T
p
Preheat
T = 25º C to T
)
Time, t (seconds)
t
S
Vinculum VNC1L Embedded USB Host Controller IC Datasheet Version 2.02
p
P
Pb Free Solder Process
3°C / second Max.
150°C
200°C
60 to 180 seconds
217°C
60 to 150 seconds
260°C
20 to 40 seconds
6°C / second Max.
8 minutes Max.
Ramp Up
t
p
t
L
Document Reference No.: FT_000030
Non-Pb Free Solder Process
3°C / second Max.
100°C
150°C
60 to 120 seconds
183°C
60 to 150 seconds
240°C
10 to 30 seconds
6°C / second Max.
6 minutes Max.
Ramp
Down
Critical Zone: when
T is in the range
Clearance No.: FTDI# 50
T to T
L
p
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