MAX9175EUB+T Maxim Integrated, MAX9175EUB+T Datasheet - Page 14

• Manufacturer Part Number: MAX9175EUB+T
• Description: LVDS Interface IC 670MHz LVDS->LVDS & X->LVDS 1
• Manufacturer: Maxim Integrated

Specifications of MAX9175EUB+T

• Rohs: yes

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
14
© 2004 Maxim Integrated Products
670MHz LVDS-to-LVDS and Anything-to-LVDS
1:2 Splitters
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
www.maxim-ic.com/packages.)
PIN 1
INDEX
AREA
PACKAGE VARIATIONS
PKG. CODE
T633-1
T833-1
T1033-1
1
SYMBOL
COMMON DIMENSIONS
A
D
E
A1
L
k
A2
10
N
6
8
MIN.
0.70
2.90
2.90
0.00
0.20
D
0.25 MIN.
0.20 REF.
1.50±0.10
1.50±0.10
1.50±0.10
NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY
Printed USA
MAX.
D2
0.80
3.10
3.10
0.05
0.40
2.30±0.10
2.30±0.10
2.30±0.10
A
E
E2
0.95 BSC
0.65 BSC
0.50 BSC
e
A1
A
MO229 / WEED-3
MO229 / WEEA
MO229 / WEEC
JEDEC SPEC
A2
L
DETAIL A
E2
L C
e
Package Information (continued)
0.30±0.05
0.25±0.05
0.40±0.05
b
is a registered trademark of Maxim Integrated Products.
b
e
N
[(N/2)-1] x e
1.95 REF
2.00 REF
1.90 REF
TITLE:
APPROVAL
TITLE:
APPROVAL
PROPRIETARY INFORMATION
PROPRIETARY INFORMATION
TDFN, EXPOSED PAD, 3x3x0.80 mm
TDFN, EXPOSED PAD, 3x3x0.80 mm
PACKAGE OUTLINE, 6, 8 & 10L,
PACKAGE OUTLINE, 6, 8 & 10L,
SEMICONDUCTOR
C0.35
SEMICONDUCTOR
DALLAS
DALLAS
D2
e
L C
DOCUMENT CONTROL NO.
DOCUMENT CONTROL NO.
k
21-0137
21-0137
L
1
L
[(N/2)-1] x e
PIN 1 ID
REF.
REV.
REV.
D
D
1
2
2
2