93LC56AT-I/OT Microchip Technology, 93LC56AT-I/OT Datasheet
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93LC56AT-I/OT
Specifications of 93LC56AT-I/OT
93LC56AT-I/OTG
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93LC56AT-I/OT Summary of contents
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... I, E Yes 8 or 16-bit I, E Description: The Microchip Technology Inc. 93XX56A/B/C devices are 2K bit low-voltage serial Electrically Erasable PROMs (EEPROM). Word-selectable devices such as the 93AA56C, 93LC56C or 93C56C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX56A devices are available, while the 93XX56B devices provide dedicated 16-bit communication ...
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... Package Types (not to scale) ROTATED SOIC PDIP/SOIC (ex: 93LC46BX ORG CLK CLK TSSOP/MSOP SOT-23 (ST, MS) (OT CLK ORG DFN CLK 2 6 ORG ORG pin A/B devices DS21794E-page 2 (P, SN ORG * CLK © 2007 Microchip Technology Inc. ...
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... Note 1: This parameter is periodically sampled and not 100% tested. 2: ORG pin not available on ‘A’ or ‘B’ versions. 3: Ready/Busy status must be cleared from DO, see Section 3.4 "Data Out (DO)". © 2007 Microchip Technology Inc. Industrial (I -40°C to +85° Automotive (E -40°C to +125°C, V ...
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... Erase/Write mode (AA and LC versions) — Erase/Write mode (93C versions) ERAL mode, 4.5V ≤ V — WRAL mode, 4.5V ≤ V — — cycles 25°C, V © 2007 Microchip Technology Inc. = +1.8V +5. +2.5V +5. Conditions < 5.5V, 93XX56C only CC < 5.5V CC < 2.5V CC < 5.5V, 93XX56C only CC < ...
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... WRAL 1 0 TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX56A OR 93XX56C WITH ORG = 0) Instruction SB Opcode ERASE 1 00 ERAL EWDS EWEN READ WRITE 1 00 WRAL 1 0 © 2007 Microchip Technology Inc. T CKH T CKL T DIH T PD Status Valid Address Data D15 – D0 D15 – ...
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... ERASE or WRITE instruction can be executed. Block Diagram Address Memory Array Decoder Address Counter Data Register DI Mode Decode ORG* Logic CS Clock CLK Register *ORG input is not available on A/B devices © 2007 Microchip Technology Inc. is below CC DO Output Buffer ...
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... High-Z DO © 2007 Microchip Technology Inc. The DO pin indicates the Ready/Busy status of the device brought high after a minimum of 250 ns low ( logical ‘0’ indicates that programming CSL is still in progress logical ‘1’ indicates that the register at the specified address has been erased and the device is ready for another instruction ...
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... Start bit and then taking CS low will clear the Ready/Busy status from DO. must be ≥ 4.5V for proper operation of ERAL CSL ••• CSL ••• Check Status Busy Ready High Check Status Busy Ready High-Z EC © 2007 Microchip Technology Inc. ...
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... High-Z DO © 2007 Microchip Technology Inc. Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is executed or Vcc is removed from the device. To protect against accidental data disturbance, the EWDS instruction can be used to disable all erase/write functions and should follow all programming opera- tions ...
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... After the Write cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. T CSL ••• ••• D0 Busy CSL ••• ••• Busy Ready High Ready High-Z © 2007 Microchip Technology Inc. ...
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... CS CLK High-Z DO © 2007 Microchip Technology Inc. The DO pin indicates the Ready/Busy status of the device brought high after a minimum of 250 ns low (T ). CSL Note: After the Write All cycle is complete, issuing a Start bit and then taking CS low will clear the Ready/Busy status from DO. ...
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... V organization is selected. For proper operation, ORG must be tied to a valid logic level. 93XX56A devices are always x8 organization and 93XX56B devices are always x16 organization. Function after the PD ) CSL or Logic HI, the CC or Logic LO, the (x8) memory SS © 2007 Microchip Technology Inc. ...
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... SOT-23 XXNN 8-Lead PDIP XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP XXXX TYWW NNN 8-Lead 2x3 DFN XXX YWW NN © 2007 Microchip Technology Inc. Example: 3L56BI 5281L7 Example: 2EL7 Example: 93LC56B e I/P 3 1L7 0528 Example: 93LC56BI e SN 0528 ...
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... DFN E Temp. — — — 335 345 355 338 348 358 © 2007 Microchip Technology Inc. ...
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... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc ...
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... L L1 NOM MAX 6 0.95 BSC 1.90 BSC – 1.45 – 1.30 – 0.15 – 3.20 – 1.80 – 3.10 – 0.60 – 0.80 – 30° – 0.26 – 0.51 Microchip Technology Drawing C04-028B © 2007 Microchip Technology Inc. ...
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... Pin 1 visual index feature may vary, but must be located with the hatched area. 2. § Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc ...
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... NOM MAX 8 1.27 BSC – 1.75 – – – 0.25 6.00 BSC 3.90 BSC 4.90 BSC – 0.50 – 1.27 1.04 REF – 8° – 0.25 – 0.51 – 15° – 15° Microchip Technology Drawing C04-057B © 2007 Microchip Technology Inc. ...
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... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc ...
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... N e 0.50 BSC A 0.80 0.90 A1 0.00 0.02 A3 0.20 REF D 2.00 BSC E 3.00 BSC D2 1.30 E2 1.50 b 0.18 0.25 L 0.30 0. NOTE MAX 8 1.00 0.05 – 1.75 – 1.90 0.30 0.50 – – Microchip Technology Drawing C04-123B © 2007 Microchip Technology Inc. ...
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... REVISION HISTORY Revision B Corrections to Section 1.0, Electrical Characteristics. Section 4.1, 6-Lead SOT-23 package to OT. Revision C Added DFN package. Revision D (11/2006) Updated Package Drawings and Product ID System Revision E (3/2007) Replaced Package Drawings; Revised Product ID System (SOIC-SN package). © 2007 Microchip Technology Inc. DS21794E-page 21 ...
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... NOTES: DS21794E-page 22 © 2007 Microchip Technology Inc. ...
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... To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions. © 2007 Microchip Technology Inc. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • Distributor or Representative • ...
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... What deletions from the document could be made without affecting the overall usefulness there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21794E-page 24 Total Pages Sent ________ FAX: (______) _________ - _________ N Literature Number: DS21794E © 2007 Microchip Technology Inc. ...
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... Plastic MSOP (Micro Small outline, 8-lead SOT-23, 6-lead (Tape & Reel only Plastic DIP (300 mil body), 8-lead SN = Plastic SOIC (3.90 mm body), 8-lead ST = TSSOP, 8-lead MC = 2x3 DFN, 8-lead © 2007 Microchip Technology Inc. /XX X Examples: a) Package 93AA56C-I/MS: 2K, 256x8 or 128x16 Serial EEPROM, MSOP package, 1.8V 93AA56B-I/MS: 2K, 128x16 Serial EEPROM, MSOP package, 1 ...
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... NOTES: DS21794E-page 26 © 2007 Microchip Technology Inc. ...
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... Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...