NB3H83905CDR2G ON Semiconductor, NB3H83905CDR2G Datasheet - Page 13

• Manufacturer Part Number: NB3H83905CDR2G
• Description: Buffers & Line Drivers 1.8V/2.5V/3.3 V BUFFER
• Manufacturer: ON Semiconductor

Specifications of NB3H83905CDR2G

• Product Category: Buffers & Line Drivers
• Rohs: yes

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
D
S
S
2X
L/2
C
16
1
0.36
16X
16X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
−V−
0.10 (0.004)
A
REF
G
SOLDERING FOOTPRINT*
M
9
8
PACKAGE DIMENSIONS
1
1.26
T
16X
−U−
U
B
http://onsemi.com
H
S
CASE 948F
TSSOP−16
N
ISSUE B
V
J
7.06
S
N
DETAIL E
13
J1
DETAIL E
F
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
Ç Ç Ç
É É É
0.25 (0.010)
DIMENSIONS: MILLIMETERS
M
K1
K
−W−
NOTES:
PITCH
0.65
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.18
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10
4.50
1.20
0.15
0.75
0.28
0.20
0.16
0.30
0.25
8
_
0.193
0.169
0.002
0.020
0.007
0.004
0.004
0.007
0.007
MIN
−−−
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.047
0.006
0.030
0.008
0.006
0.012
0.010
0.011
MAX
8
_