93LC56C-I/P Microchip Technology, 93LC56C-I/P Datasheet - Page 15

• Manufacturer Part Number: 93LC56C-I/P
• Description: IC EEPROM 2KBIT 3MHZ 8DIP
• Manufacturer: Microchip Technology

Specifications of 93LC56C-I/P

• Memory Size: 2K (256 x 8 or 128 x 16)
• Package / Case: 8-DIP (0.300", 7.62mm)
• Operating Temperature: -40°C ~ 85°C
• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Speed: 2MHz, 3MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Organization: 128 K x 16 or 256 x 8
• Interface Type: 2-Wire
• Maximum Clock Frequency: 2 MHz
• Access Time: 6 ms
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 0.5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Memory Configuration: 256 X 8, 128 X 16
• Clock Frequency: 3MHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: DIP
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 93LC56C-I/PR; 93LC56C-I/PR

© 2007 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
2
b
D
e
E1
A2
Dimension Limits
E
c
Units
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
MIN
0.75
0.00
0.40
0.08
0.22
0°
–
L1
MILLIMETERS
3.00 BSC
0.65 BSC
4.90 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
8
–
–
–
–
–
Microchip Technology Drawing C04-111B
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
L
DS21794E-page 15
φ