MAX9975ARCCQ+TD Maxim Integrated, MAX9975ARCCQ+TD Datasheet - Page 30

• Manufacturer Part Number: MAX9975ARCCQ+TD
• Description: Buffers & Line Drivers
• Manufacturer: Maxim Integrated

Specifications of MAX9975ARCCQ+TD

• Rohs: yes

Table
Dual, Low-Power, 1200Mbps ATE
Driver/Comparator with 35mA Load
Analog control input THR sets the threshold for the
input logic, allowing operation with CMOS logic as low
as 0.9V. Leaving THR unconnected results in a nominal
threshold of 1.25V from an internal reference, providing
compatibility with 2.5V to 3.3V logic.
The MAX9975 supplies a temperature output signal,
TEMP, that asserts a 3.33V nominal output voltage at a
+70°C (343K) die temperature. The output voltage
changes proportionally with temperature at 10mV/°C.
30
BIT
D7
D6
D5
D4
D3
D2
D1
D0
______________________________________________________________________________________
TMSEL
LLEAK
NAME
LDDIS
CDIFF
CH1
CH2
SC1
SC0
5. Shift Register Functions
Channel 1 Write Enable. Set to 1 to update the
control byte for channel 1. Set to 0 to make no
changes to channel 1.
Channel 2 Write Enable. Set to 1 to update the
control byte for channel 2. Set to 0 to make no
changes to channel 2.
Low-Leakage Select. Set to 1 to put driver,
load, and clamps in low-leakage mode.
Comparators remain active in low-leakage
mode, but at reduced speed. Set to 0 for
normal operation.
Termination Select. Driver Termination Select
Bit. Set to 1 to force the driver output to the
DTV_ voltage when RCV_ = 1 (term mode). Set
to 0 to place the driver into high-impedance
mode when RCV_ = 1 (high-Z). See Table 1.
Driver Slew Rate Select. SC1 and SC0 set the
driver slew rate. See Table 2.
Differential Comparator Enable. Set to 1 to
enable the differential comparators and
disable the CH_ window comparators. Set to 0
to enable the CH_ window comparators and
disable the differential comparators. See
Tables 3a and 3b.
Load D i sab l e. S et LD D IS to 1 to d i sab l e the
DESCRIPTION
Temperature Monitor
Table
Conditions
Under normal circumstances, the MAX9975 requires
heat removal through the exposed pad by use of an
external heat sink. The exposed pad is electrically at
V
isolated.
Power dissipation is highly dependent upon the appli-
cation. The Electrical Characteristics table indicates
power dissipation under the condition that the source
and sink currents are programmed to 0mA. Maximum
dissipation occurs when the source and sink currents
are both at 35mA, the V
voltage range, and the diode bridge is fully commutat-
ed. Under these conditions, the additional power dissi-
pated (per channel) is:
If DUT_ is sourcing current:
If DUT_ is sinking current:
DUT_ sources the programmed (low) current when
V
through the outside of the diode bridge and the source
(low) current source to V
rent is greatly reduced by the class AB load architecture.
DUT_ sinks the programmed (high) current when V
< V
the sink (high) current source and the outside of the
diode bridge to DUT_. The programmed source current
is greatly reduced by the Class AB architecture.
θ
mately 1°C/W to 2°C/W. Die temperature is thus highly
dependent upon the heat removal techniques used in
the application. Maximum total power dissipation
occurs under conditions shown in Table 6.
JC
EE
DUT_
I
SOURCE
PARAMETER
COM_
of the exposed-pad package is very low, approxi-
potential, and must be either connected to V
V
V
LOAD
> V
V
COM_
V
DUT_
6. Maximum Power Dissipation
CC
EE
. The path of the current is from V
= I
COM_
SINK
P
D
P
D
= (V
. The path of the current is from DUT_
= (V
DUT_
Both Channels
CC
MAX9975AR
Enabled
+10.5V
EE
-5.25V
+0.5V
35mA
DUT
- V
-1.5V
- V
. The programmed sink cur-
DUT_
EE
_ is at an extreme of the
) x I
Heat Removal
) x I
SOURCE
SINK
Both Channels
MAX9975AZ
Enabled
-4.75V
35mA
+0.5V
CC
+11V
-1V
through
EE
DUT_
or