NCN3411 ON Semiconductor, NCN3411 Datasheet - Page 10
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NCN3411
Manufacturer Part Number
NCN3411
Description
Peripheral Drivers & Components - PCIs
Manufacturer
ON Semiconductor
Datasheet
1.NCN3411.pdf
(10 pages)
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.10 C
0.05 C
REFERENCE
NOTE 4
PIN ONE
42X
0.10 C A B
42X
0.08
0.15
0.10
NOTE 3
A B B
DETAIL A
0.15
L
b
C
C
C
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç
e/2
17
C
BOTTOM VIEW
1
DETAIL B
e
TOP VIEW
SIDE VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D2
D
38
22
E2
A
A1
A
K
A3
E
B
C
0.10 C A B
SEATING
PLANE
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
L1
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
EXPOSED Cu
WQFN42 3.5x9, 0.5P
http://onsemi.com
CASE 510AP−01
ALTERNATE TERMINAL
CONSTRUCTIONS
CONSTRUCTION
ISSUE O
DETAIL A
DETAIL B
ALTERNATE
É É É É
É É
10
L
MOLD CMPD
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
3.80
0.63
2.16
42X
L
0.35
42X
MOUNTING FOOTPRINT*
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED PAD
RECOMMENDED
Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
L1
A
D
E
K
b
e
L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
MIN
0.70
0.00
0.20
1.95
7.45
0.20
0.30
0.00
9.30
3.50 BSC
9.00 BSC
0.50 BSC
0.20 REF
MAX
DIMENSIONS: MILLIMETERS
0.80
0.05
0.30
2.15
7.65
0.50
0.15
−−−
PACKAGE
OUTLINE
NCN3411/D
PITCH
0.50