MC14049BCP ON Semiconductor, MC14049BCP Datasheet - Page 7

• Manufacturer Part Number: MC14049BCP
• Description: Buffers & Line Drivers 3-18V Hex CMOS
• Manufacturer: ON Semiconductor

Specifications of MC14049BCP

• Product Category: Buffers & Line Drivers
• Number Of Input Lines: 6
• Number Of Output Lines: 6
• Polarity: Inverting
• Supply Voltage - Max: 18 V
• Supply Voltage - Min: 3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Package / Case: PDIP-16
• High Level Output Current: - 4.7 mA
• Logic Family: 4000
• Logic Type: CMOS
• Low Level Output Current: 30 mA
• Minimum Operating Temperature: - 55 C
• Number Of Channels Per Chip: 5
• Propagation Delay Time: 140 ns at 5 V, 80 ns at 10 V, 60 ns at 15 V
• Factory Pack Quantity: 25

−T−
SEATING
PLANE
16
1
G
D
0.25 (0.010)
−A−
16 PL
M
*For additional information on our Pb−Free strategy and soldering
T
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
9
8
K
B
−B−
S
0.58
16X
A
C
S
P
8 PL
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
PLASTIC SOIC PACKAGE
0.25 (0.010)
http://onsemi.com
1
8
CASE 751B−05
M
D SUFFIX
SOIC−16
ISSUE K
6.40
8X
16X
M
7
R
DIMENSIONS: MILLIMETERS
B
1.12
X 45
16
S
9
_
J
PITCH
1.27
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
G
K
M
P
R
F
J
MILLIMETERS
MIN
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
0
1.27 BSC
_
10.00
MAX
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
0.050 BSC
0
INCHES
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_