AT93C56A-10TU-1.8 Atmel, AT93C56A-10TU-1.8 Datasheet - Page 19

• Manufacturer Part Number: AT93C56A-10TU-1.8
• Description: IC EEPROM 2KBIT 2MHZ 8TSSOP
• Manufacturer: Atmel

Specifications of AT93C56A-10TU-1.8

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 2K (256 x 8 or 128 x 16)
• Speed: 250kHz, 1MHz, 2MHz
• Interface: 3-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-TSSOP
• Package: 8TSSOP
• Interface Type: Serial-3Wire
• Density: 2 Kb
• Maximum Operating Frequency: 0.25 MHz
• Typical Operating Supply Voltage: 2.5|3.3|5 V
• Organization: 256x8|128x16
• Data Retention: 100 Year
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

8.6
3378O–SEEPR–11/09
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
8A2 – TSSOP
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
5. Dimension D and E1 to be determined at Datum Plane H.
R
datums, etc.
0.15 mm (0.006 in) per side.
(0.010 in) per side.
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
2325 Orchard Parkway
San Jose, CA 95131
Top View
Side View
Pin 1 indicator
3
this corner
D
b
2
e
1
N
A2
E1
A
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
E
SYMBOL
D
E
E1
A
A2
b
e
L
L1
End View
2.90
4.30
0.80
0.19
0.45
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
–
L
L1
6.40 BSC
0.65 BSC
1.00 REF
NOM
3.00
4.40
1.00
0.60
–
–
AT93C56A/66A
MAX
3.10
4.50
1.20
1.05
0.30
0.75
DRAWING NO.
NOTE
8A2
2, 5
3, 5
4
5/30/02
REV.
B
19