NCL30083BDMR2G ON Semiconductor, NCL30083BDMR2G Datasheet - Page 20

• Manufacturer Part Number: NCL30083BDMR2G
• Description: LED Lighting Drivers Step-Dimm Quasi-Res I-Mode Cntlr
• Manufacturer: ON Semiconductor

Specifications of NCL30083BDMR2G

• Rohs: yes
• Input Voltage: 18 V
• Operating Frequency: 65 kHz
• Maximum Supply Current: 1.2 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: Micro-8
• Minimum Operating Temperature: - 40 C

Thermal Fold−back and Over Voltage / Over
Temperature Protection
LED string when the ambient temperature exceeds a set
point. The current is gradually reduced to 50% of its nominal
value if the temperature continues to rise. (Figure 58). The
thermal foldback starting temperature depends on the
Negative Coefficient Temperature (NTC) resistor chosen by
the power supply designer.
to sense the ambient temperature. When the SD pin voltage
V
constant current control V
V
V
current.
SD
SD
REF50
The thermal fold−back circuit reduces the current in the
Indeed, the SD pin allows the direct connection of an NTC
Rsense
. When V
drops below V
CS
, corresponding to 50% of the nominal output
SD
LEB2
LEB1
reaches V
Figure 56. Winding Short Circuit Protection, Max. Peak Current Limit Circuits
TF(start)
V
CS(stop)
V
Vcontrol
ILIMIT
REF
, the internal reference for the
TF(stop)
is decreased proportionally to
Figure 57. Output Current Reduction versus SD Pin Voltage
50% I
+
−
+
−
+
, V
−
I
out(nom)
out(nom)
REF
I
out
is clamped to
WOD_SCP
PWMreset
V
Ipkmax
OTP(off)
http://onsemi.com
V
V
8_HICC
TF(stop)
OTP(on)
20
OVP
auto−recovery fault mode for version B, meaning that the
4−s timer is activated. The controller will re−start switching
after the 4−s timer has elapsed and when V
provide some temperature hysteresis (around 10°C).
V
roughly to the following resistances:
•
•
•
•
Temperature increases
Temperature decreases
CC
If V
For version A, this protection is latched: reset occurs when
The thermal fold−back and OTP thresholds correspond
S
R
Thermal fold−back starts when R
Thermal fold−back stops when R
OTP triggers when R
OTP is removed when R
Q
Q
< V
SD
S
R
V
STOP
from Fault Management Block
CC(reset)
TF(start)
Q
Q
drops below V
OFF WOD_SCP
DRV
latch
.
OVP
8_HICC
grand
reset
NTC
OTP
V
management
SD
NTC
UVLO
Vdd
, the controller enters into the
≤ 5.88 kW.
Vcc
≥ 8.24 kW.
grand
S
R
reset
Q
Q
latch
NTC
NTC
VCCstop
≤ 8.24 kW.
≤ 11.76 kW.
SD
> V
OTP(on)
VCC
aux
to