MAX16839ATT/V+T Maxim Integrated, MAX16839ATT/V+T Datasheet - Page 2

• Manufacturer Part Number: MAX16839ATT/V+T
• Description: LED Lighting Drivers High-Voltage Linear High-Brightness LED Driver with LED Fault Open Detect
• Manufacturer: Maxim Integrated

Specifications of MAX16839ATT/V+T

• Input Voltage: 5 V to 40 V
• Maximum Supply Current: 15 mA to 100 mA

ABSOLUTE MAXIMUM RATINGS
High-Voltage, Linear High-Brightness LED
Driver with Open-LED Fault Detect
(Voltages are specified with respect to GND.)
IN, SINK .................................................................-0.3V to +45V
FLTS ......................................................................-0.3V to +18V
DIM ..........................................................................-0.3V to +6V
CS .........................................................................-0.3V to +0.5V
Continuous Current into SINK and CS .............................120mA
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
ELECTRICAL CHARACTERISTICS
(V
otherwise noted. Typical values are at T
2
Supply Voltage Range
Quiescent Current
Undervoltage Lockout
UVLO Hysteresis
CS REGULATOR
CS Voltage Accuracy
CS Load Regulation
Internal Switch On-Resistance
LED CURRENT TRANSIENT RESPONSE
LED Current Turn-On Delay
LED Current Turn-On Delay
Relative to DIM
LED Current Turn-Off Delay
Relative to DIM
LED Current Rise Time
LED Current Fall Time
IN
6-Pin TDFN (derate 23.8mW/NC above +70NC) .....1904.8mW
8-Pin SO (derate 18.9mW/NC above +70NC) ..........1509.4mW
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
______________________________________________________________________________________
= 12V, V
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
FLTS
= 0V, R
CS
= 4.07I, V
A
= +70NC)
SYMBOL
R
V
t
DS_ON
V
t
DDIN
UVLO
A
V
DIN
I
GND
IN
CS
t
JC
t
IN
r
f
= +25NC.) (Note 3)
) ..................... 9NC/W
JA
= 0V, DIM = unconnected, C
) ..........42NC/W
V
T
-40NC P T
(Note 4)
20mA P I
(Note 5)
30% of V
V
V
V
10% of I
90% of I
A
IN
DIM
DIM
DIM
= +25NC
rising
= 2.1V (Notes 6, 7)
rising edge to 50% of I
falling edge to 50% of I
SINK
SINK
SINK
IN
A
P +125NC, 0.9V P V
rising edge to 50% of I
to 90% of I
to 10% of I
P 100mA
CONDITIONS
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
SO
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
SINK
SINK
IN
SINK
SINK
= 0.1FF (Note 2), T
SINK
SINK
P 5.5V
,
195.5
MIN
193
J
5
= T
A
= -40NC to +125NC, unless
TYP
0.25
203
3.6
0.3
2.3
1.3
2.5
2.5
40
2
4
JC
) .................5NC/W
210.5
JA
MAX
213
0.6
5.5
3.5
5.5
40
4
9
6
) ..........53NC/W
UNITS
FV/mA
mA
mV
Fs
Fs
Fs
Fs
Fs
I
V
V
V