M24C16-RMB6TG STMicroelectronics, M24C16-RMB6TG Datasheet - Page 5

• Manufacturer Part Number: M24C16-RMB6TG
• Description: IC EEPROM 16KBIT 400KHZ 8UFDFPN
• Manufacturer: STMicroelectronics

Specifications of M24C16-RMB6TG

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 16K (2K x 8)
• Speed: 400kHz
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-MLP, 8-UFDFPN
• Memory Configuration: 2048 X 8
• Interface Type: I2C, Serial
• Clock Frequency: 400kHz
• Access Time: 900ns
• Supply Voltage Range: 1.8V To 5.5V
• Memory Case Style: DFN
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8704-2; M24C16-RMB6TG

M24C16, M24C08, M24C04, M24C02, M24C01
List of figures
Figure 1.
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Figure 5.
Figure 6.
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Figure 10.
Figure 11.
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Figure 16.
Figure 17.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
M24C08-F WLCSP and thin WLCSP connections
Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Maximum R
I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 13
Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 14
Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
WLCSP (0.5 mm) and Thin WLCSP (0.3 mm) 0.4 mm pitch 5 bumps,
SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 28
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 30
PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 31
(top view, marking side, with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
P
value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . . 9
Doc ID 5067 Rev 16
List of figures
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