M93C66-WMN6P STMicroelectronics, M93C66-WMN6P Datasheet - Page 36

• Manufacturer Part Number: M93C66-WMN6P
• Description: IC EEPROM 4KBIT 2MHZ 8SOIC
• Manufacturer: STMicroelectronics

Specifications of M93C66-WMN6P

• Format - Memory: EEPROMs - Serial
• Memory Type: EEPROM
• Memory Size: 4K (512 x 8 or 256 x 16)
• Speed: 2MHz
• Interface: Microwire, 3-Wire Serial
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Organization: 512 x 8
• Interface Type: Microwire
• Maximum Clock Frequency: 2 MHz
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.5 V
• Maximum Operating Current: 2 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Supply Voltage: 2.5 V, 5.5 V
• Memory Configuration: 512 X 8, 256 X 16
• Clock Frequency: 2MHz
• Supply Voltage Range: 2.5V To 5.5V
• Memory Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5672-5

Revision history
36/37
Table 34.
29-Jan-2008
01-Apr-2010
29-Apr-2010
31-Jul-2007
Date
Document revision history (continued)
Revision
10
7
8
9
Document reformatted. TSSOP8 3 × 3 mm (DS) package removed.
Erase/Write Enable (EWEN) instruction replaced by Write Enable
(WEN). Erase/Write Disable (EWDS) instruction replaced by Write
Disable (WDS).
Section 7: Initial delivery state
STANDBY POWER MODES section removed.
I
and
t
Table
SO8 narrow and UFDFPN8 package specifications updated (see
Section 12: Package mechanical
Table
Blank option removed under Plating technology in
8 lead thin shrink small outline, package mechanical
Section 2: Connecting to the serial bus
Small text changes.
M93C76-R root part number added.
Section 2: Connecting to the serial bus
added to
and paragraph added).
Section 3.1.2: Power-up conditions
T
V
16,
M93C56-R is also offered in TSSOP8 package (see
Package mechanical inch values calculated from mm and rounded to 4
decimal digits in
TSSOP8 (DW) package specifications updated.
Modified footnote in
Updated
flat package no lead 2 x 3 mm, outline
Updated
range, temperature grade)
CC1
W
LEAD
OH
parameter description modified in
17
Table
min guaranteed at a higher value in DC characteristics tables 15,
test conditions modified in
Doc ID 4997 Rev 10
23..
29,
modified in
and 18.
Figure 14: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual
Figure 31: Available M93C66-x products (package, voltage
Figure 3: Bus master and memory devices on the serial bus
Table
19. Note 1 added to
30,
Section 12: Package mechanical data
Table 8: Absolute maximum
Table
M93C86, M93C76, M93C66, M93C56, M93C46
Table 15
31,
UFDFPN option.
Table 32
and
modified, ACTIVE POWER AND
Table
Changes
Table
data).
Table 16 on page 23
corrected.
15.
Table
15,
and
and
added. Device grade 7 removed.
modified (pull-down resitor
Table
Table 33
20,
Table 26 on page 31
ratings.
Table
16,
Table 27: TSSOP8 –
Table
added.
Table
21,
data.
Table 22
17,
30).
Table 18
and